专利检索 ap:("PARKER HANNIFIN INC" OR "LICHTENSTEIN P ROSS" OR "PENG HONG") AND inv:"LICHTENSTEIN P ROSS" 第 1 页

1.

发明申请
INTERFERENCE MITIGATION THROUGH CONDUCTIVE THERMOPLASTIC COMPOSITE MATERIALS 审中-公开
标题翻译：通过导电热塑性复合材料进行干涉减弱

公开(公告)号：WO0243456A3

公开(公告)日：2003-05-22

申请号：PCT/US0143624

申请日：2001-11-20

申请人： PARKER HANNIFIN INC , LICHTENSTEIN P ROSS , PENG HONG

发明人： LICHTENSTEIN P ROSS , PENG HONG

IPC分类号： H01L23/373 , H01L23/552 , H05K9/00

CPC分类号： H01L23/552 , H01L23/3737 , H01L2924/0002 , H01L2924/16152 , H05K9/003 , Y10S428/901 , Y10T428/1352 , Y10T428/1355 , H01L2924/00

摘要： An electromagnetic radiation interference mitigation shield (10) is provided for an electronic circuit component (E). The shield includes a body (12) formed from an electrically and thermally conductive composite material characterized by a volume resistivity ranging from about 0.1 to about 1,000 ohm-cm and a thermal conductivity ranging from about 10 x 10 -cal.-cm./sec.- cm. - DEG C to about 30 x 10 -cal.-cm./sec.-cm. - DEG C.

摘要翻译： 为电子电路部件（E）提供电磁辐射干扰减轻屏蔽（10）。屏蔽包括由导电和导热的复合材料形成的主体（12），其特征在于其体积电阻率为约0.1至约1,000欧姆 - 厘米，热导率为约10×10 -4 -cal.- cm 2 /℃至约30×10 -4 -cal.-cm./sec.-cm。2℃。