公开(公告)号：WO2015192069A1

公开(公告)日：2015-12-17

申请号：PCT/US2015/035647

申请日：2015-06-12

Applicant: PDF SOLUTIONS, INC.

Inventor： DE, Indranil ,  CIPLICKAS, Dennis, J. ,  LAM, Stephen ,  HAIGH, Jonathan ,  ROVNER, Vyacheslav, V. ,  HESS, Christopher ,  BROZEK, Tomasz, W. ,  STROLJWAS, Andrezej, J. ,  DOONG, Kelvin ,  KIBARIAN, John, K. ,  LEE, Sherry, F. ,  MICHAELS, Kimon, W. ,  STROJWAS, Marcin, A. ,  O'SULLIVAN, Conor ,  JAIN, Mehul

IPC: H01L23/58

CPC classification number: H01L22/30 ,  H01L22/12 ,  H01L22/14 ,  H01L22/34 ,  H01L27/0207

Abstract: Product ICs/wafers include additional diagnostic, test, or monitoring structures opportunistically placed in filler cell positions, within tap cells, within decap cells, within scribe line areas, and/or within dummy fill regions. Improved fabrication processes utilize data from such structure (s) in wafer disposition decisions, rework decisions, process control, yield learning, or fault diagnosis.

Abstract translation: 产品IC /晶片包括机会性放置在填充单元位置，抽头单元内，分解单元内，划线区域内和/或虚拟填充区域内的附加诊断，测试或监视结构。 改进的制造工艺利用晶片配置决定，返工决定，过程控制，产量学习或故障诊断中的这种结构的数据。