公开(公告)号：WO0117724A3

公开(公告)日：2001-09-27

申请号：PCT/US0023861

申请日：2000-08-30

Applicant: PHILIPS SEMICONDUCTORS INC ,  KONINKL PHILIPS ELECTRONICS NV

Inventor： ZHANG LIMING ,  DUNTON SAMUEL VANCE ,  WELING MILIND GANESH

IPC: B24B1/04 ,  B24B41/06 ,  B24B53/007 ,  B24B57/02 ,  H01L21/304 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B1/04 ,  B24B41/061 ,  B24B57/02

Abstract: The present invention is an ultrasonic transducer slurry dispensing device (110) and method for efficiently distributing slurry. The present invention utilizes ultrasonic energy to facilitate efficient slurry application in a IC wafer fabrication process to permits reduced manufacturing times and slurry consumption during IC wafer fabrication. In one embodiment a chemical mechanical polishing (CMP) ultrasonic transducer slurry dispenser device (100) includes a slurry dispensing slot (121-123), a slurry chamber (130) coupled and an ultrasonic transducer (111-114). The slurry chamber (130) receives the slurry and transports it to the slurry dispensing slots (121-123) that apply slurry to a polishing pad. The ultrasonic transducer (111-114) transmits ultrasonic energy to the slurry. The transmitted ultrasonic energy permits an ultrasonic transducer slurry dispensing device (100) and method of the present invention to achieve a relatively consistent removal rate and a smoother polished wafer surface by facilitating particle disbursement, polishing pad conditioning and uniform slurry distribution.

Abstract translation: 本发明是一种超声波换能器浆液分配装置（110）和用于有效分配浆液的方法。 本发明利用超声能量促进IC晶片制造过程中的有效浆料施加，以允许在IC晶片制造期间减少制造时间和浆料消耗。 在一个实施例中，化学机械抛光（CMP）超声换能器浆液分配器装置（100）包括浆液分配槽（121-123），耦合的浆液室（130）和超声换能器（111-114）。 浆液室（130）接收浆液并将浆液输送到将浆液施加到抛光垫上的浆液分配槽（121-123）。 超声波换能器（111-114）将超声波能量传输到浆液。 透射的超声波能量允许本发明的超声换能器浆料分配装置（100）和方法通过促进颗粒分配，抛光垫调节和均匀的浆料分布而实现相对一致的移除速率和更光滑的抛光晶片表面。