ELECTRONIC STRUCTURES AND THEIR METHODS OF MANUFACTURE

    公开(公告)号:WO2018178657A1

    公开(公告)日:2018-10-04

    申请号:PCT/GB2018/050805

    申请日:2018-03-27

    Abstract: A structure is disclosed, comprising: a first field effect transistor, FET, comprising a first source terminal, a first drain terminal, a first layer or body of semiconductive material arranged to provide a first semiconductive channel connecting the first source terminal to the first drain terminal, and a gate terminal arranged with respect to the first semiconductive channel such that a conductivity of the first semiconductive channel may be controlled by application of a voltage to the gate terminal; and a second FET comprising a second source terminal, a second drain terminal, a second layer or body of semiconductive material arranged to provide a second semiconductive channel connecting the second source terminal to the second drain terminal, and the gate terminal, the second conductive channel being arranged with respect to the gate terminal such that a conductivity of the second channel may be controlled by application of a voltage to the gate terminal. Methods of manufacturing such structures are also disclosed.

    A MULTI-PROTOCOL RFID TAG AND SYSTEM
    2.
    发明申请

    公开(公告)号:WO2020128425A1

    公开(公告)日:2020-06-25

    申请号:PCT/GB2019/053410

    申请日:2019-12-03

    Abstract: The present invention provides for a RFID tag assembly that is suitable for operation with at least one RFID reader assembly. The RFID tag assembly comprises, inter alia , an antenna member for transmitting and/or receiving an RFID signal, and at least one integrated circuit (1C) for processing the RFID signal and which is configured to communicate, alternatingly and sequentially in time, a first signal transmission and at least one second signal transmission, each defined by a plurality of predetermined signal transmission parameters, to the at least one RFI D reader assembly, utilising time-division multiplexing, wherein the at least one first signal transmission differs from the at least one second signal transmission in at least one of said plurality of predetermined signal transmission parameters.

    MEASUREMENT APPARATUS
    3.
    发明申请

    公开(公告)号:WO2019171041A1

    公开(公告)日:2019-09-12

    申请号:PCT/GB2019/050607

    申请日:2019-03-05

    Abstract: Measurement apparatus, for generating a first output signal indicative of a measurand, comprises: a first oscillator circuit and a second oscillator circuit, each oscillator circuit being arranged to generate a respective oscillating output signal and comprising at least a respective first component having a property determining a respective output frequency of the respective oscillating output signal; a sensor for sensing said measurand, the sensor comprising said first component of the first oscillator circuit, said property of said first component of the first oscillator circuit being dependent upon said measurand; and circuitry arranged to receive said oscillating output signals and generate said first output signal, said first output signal being indicative of a number of cycles of one of the first and second oscillating output signals in a time period determined by a period of the other of said first and second oscillating output signals.

    INTEGRATED CIRCUIT HANDLING PROCESS AND APPARATUS

    公开(公告)号:WO2019043354A1

    公开(公告)日:2019-03-07

    申请号:PCT/GB2018/052326

    申请日:2018-08-16

    Abstract: The invention relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations in order to facilitate shipping and subsequent removal of the flexible substrate from the carrier, the process comprising the steps of: providing a flexible substrate comprising a plurality of integrated circuits thereon; providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier; changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.

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