公开(公告)号：WO2017209897A1

公开(公告)日：2017-12-07

申请号：PCT/US2017/031394

申请日：2017-05-05

Applicant: QUALCOMM INCORPORATED

Inventor： SAMMOURA, Firas ,  FUNG, Stephanie ,  KIDWELL, Donald William, Jr. ,  SHENOY, Ravindra Vaman ,  BURNS, David William

IPC: G01C9/18 ,  G01C9/20

CPC classification number: G01C9/20 ,  G01C9/18 ,  G01F23/2965

Abstract: A device may include a surface at least partially defining an enclosed region, a plurality of fluids within the enclosed region, the plurality of fluids comprising at least a first fluid having a first acoustic impedance and a second fluid having a second acoustic impedance different from the first acoustic impedance, a first piezoelectric transducer disposed on the surface, the first piezoelectric transducer being configured to generate a first wave reception signal based, at least in part, on an ultrasonic return wave received through at least one of the plurality of fluids, and a processor coupled to the first piezoelectric transducer and configured to determine a measurement of a tilt of the device based, at least in part, on the first wave reception signal.

Abstract translation: 装置可以包括至少部分地限定封闭区域的表面，封闭区域内的多种流体，所述多种流体至少包括具有第一声阻抗的第一流体和具有第一声阻抗的第二流体， 具有与所述第一声阻抗不同的第二声阻抗;布置在所述表面上的第一压电换能器，所述第一压电换能器被配置为至少部分地基于通过至少部分地通过所述第一压电换能器接收的超声返回波而生成第一波接收信号， 所述多种流体中的一种流体以及处理器，所述处理器耦合到所述第一压电换能器并且被配置为至少部分地基于所述第一波接收信号来确定所述装置的倾斜的测量值。

公开(公告)号：WO2016126881A1

公开(公告)日：2016-08-11

申请号：PCT/US2016/016458

申请日：2016-02-03

Applicant: QUALCOMM INCORPORATED

Inventor： KIDWELL, Donald William, Jr. ,  SHENOY, Ravindra ,  ERTURK, Mete ,  ROUHANA, Layal

IPC: H01L23/498 ,  H01F17/00 ,  H01L21/48

CPC classification number: H01L23/49838 ,  B23K26/0661 ,  H01F17/0033 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/585 ,  H01L28/10 ,  H01L2224/16227 ,  H01L2924/15311

Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.

Abstract translation: 集成器件封装包括管芯和封装衬底。 封装衬底包括至少一个电介质层（例如芯层，预镀层），电介质层中的磁芯，被配置为作为第一保护环工作的第一多个互连件和被构造成操作的第二多个互连件 作为第一电感器。 所述第二多个互连件定位在所述封装衬底中以至少部分地围绕所述磁芯。 来自第二多个互连的至少一个互连也是第一多个互连的一部分。 在一些实施方案中，第一保护环是不连续的保护环。 在一些实施方式中，第一电感器是螺线管电感器。 在一些实施方案中，磁芯包括载体，第一磁性层和第二磁性层。