公开(公告)号：WO2009139728A1

公开(公告)日：2009-11-19

申请号：PCT/SG2009/000172

申请日：2009-05-13

Applicant: ROKKO VENTURES PTE LTD ,  LING, Nee, Seng ,  ANG, Soo, Loo

Inventor： LING, Nee, Seng ,  ANG, Soo, Loo

IPC: H05K13/08 ,  H05K13/04 ,  G01N21/956 ,  H05K3/00

CPC classification number: G01N35/026 ,  G01N21/95684 ,  G01N2035/00089

Abstract: A system for inspection and collating substrates comprising a receiving rack in communication with a reflow oven (20); said receiving rack arranged to receive a plurality of substrates from said reflow oven; an inspection device (40) for inspecting said substrates and recording a status of each inspected substrate; a collector for receiving said substrates (10) from said receiving rack, the collector including a racking device for collating the substrates according to the recorded status.

Abstract translation: 一种用于检查和整理衬底的系统，包括与回流炉（20）连通的接收架; 所述接收架布置成从所述回流炉接收多个基板; 检查装置（40），用于检查所述基板并记录每个被检查基板的状态; 用于从所述接收架接收所述基板（10）的收集器，所述收集器包括用于根据记录状态对准所述基板的货架装置。

公开(公告)号：WO2009157876A1

公开(公告)日：2009-12-30

申请号：PCT/SG2009/000224

申请日：2009-06-19

Applicant: ROKKO VENTURES PTE LTD ,  ANG, Soo, Loo ,  LING, Nee, Seng ,  YAU, Kam, Hung ,  PAI, Luke

Inventor： ANG, Soo, Loo ,  LING, Nee, Seng ,  YAU, Kam, Hung ,  PAI, Luke

IPC: B23K3/06

CPC classification number: B23K3/0623 ,  H05K3/3478

Abstract: A solder ball mounting module comprising a solder ball template (22) having an array of recesses (20), each recess being in communication with a vacuum source (35), and each arranged to receive a solder ball (15); wherein each recess further includes an ejector pin (110) for selectively ejecting the respective solder ball engaged therein.

Abstract translation: 一种焊球安装模块，包括具有凹槽阵列（20）的焊球模板（22），每个凹槽与真空源（35）连通，并且每个凹陷模板（22）被布置成接收焊球（15）; 其中每个凹部还包括用于选择性地喷射接合在其中的相应焊球的顶针（110）。