公开(公告)号：WO2009139728A1

公开(公告)日：2009-11-19

申请号：PCT/SG2009/000172

申请日：2009-05-13

Applicant: ROKKO VENTURES PTE LTD ,  LING, Nee, Seng ,  ANG, Soo, Loo

Inventor： LING, Nee, Seng ,  ANG, Soo, Loo

IPC: H05K13/08 ,  H05K13/04 ,  G01N21/956 ,  H05K3/00

CPC classification number: G01N35/026 ,  G01N21/95684 ,  G01N2035/00089

Abstract: A system for inspection and collating substrates comprising a receiving rack in communication with a reflow oven (20); said receiving rack arranged to receive a plurality of substrates from said reflow oven; an inspection device (40) for inspecting said substrates and recording a status of each inspected substrate; a collector for receiving said substrates (10) from said receiving rack, the collector including a racking device for collating the substrates according to the recorded status.

Abstract translation: 一种用于检查和整理衬底的系统，包括与回流炉（20）连通的接收架; 所述接收架布置成从所述回流炉接收多个基板; 检查装置（40），用于检查所述基板并记录每个被检查基板的状态; 用于从所述接收架接收所述基板（10）的收集器，所述收集器包括用于根据记录状态对准所述基板的货架装置。

公开(公告)号：WO2009157876A1

公开(公告)日：2009-12-30

申请号：PCT/SG2009/000224

申请日：2009-06-19

Applicant: ROKKO VENTURES PTE LTD ,  ANG, Soo, Loo ,  LING, Nee, Seng ,  YAU, Kam, Hung ,  PAI, Luke

Inventor： ANG, Soo, Loo ,  LING, Nee, Seng ,  YAU, Kam, Hung ,  PAI, Luke

IPC: B23K3/06

CPC classification number: B23K3/0623 ,  H05K3/3478

Abstract: A solder ball mounting module comprising a solder ball template (22) having an array of recesses (20), each recess being in communication with a vacuum source (35), and each arranged to receive a solder ball (15); wherein each recess further includes an ejector pin (110) for selectively ejecting the respective solder ball engaged therein.

Abstract translation: 一种焊球安装模块，包括具有凹槽阵列（20）的焊球模板（22），每个凹槽与真空源（35）连通，并且每个凹陷模板（22）被布置成接收焊球（15）; 其中每个凹部还包括用于选择性地喷射接合在其中的相应焊球的顶针（110）。

公开(公告)号：WO2009035419A2

公开(公告)日：2009-03-19

申请号：PCT/SG2008/000346

申请日：2008-09-12

Applicant: ROKKO VENTURES PTE LTD ,  YANG, Hae Choon ,  SHIN, Yun Suk

Inventor： YANG, Hae Choon ,  SHIN, Yun Suk

IPC: B28D5/02 ,  H01L21/00 ,  H01L21/304

CPC classification number: B28D5/0082

Abstract: An apparatus (5) for dicing an integrated circuit substrate having a loader (30) for loading the substrate to the apparatus, said substrate loaded in a first direction corresponding to a loading axis, an inlet rail (35) said inlet rail including a first block (75) movable along said inlet rail (35) to which is loaded the substrate from said loader, wherein said inlet rail is arranged to deliver the first block (75) and substrate towards a chuck table (60) in a second direction orthogonal to the loading axis.

Abstract translation: 一种用于对集成电路基板进行切割的设备（5），所述集成电路基板具有用于将所述基板装载到所述装置的装载器（30），所述基板沿对应于加载轴线的第一方向装载，所述入口轨道（35）包括第一 沿着所述入口轨道（35）移动的块（75），从所述入口轨道（35）向所述入口轨道（35）移动，所述入口轨道布置成沿第二方向正交地将第一块（75）和衬底朝着卡盘台 到加载轴。

公开(公告)号：WO2009035419A3

公开(公告)日：2010-10-14

申请号：PCT/SG2008000346

申请日：2008-09-12

Applicant: ROKKO VENTURES PTE LTD ,  YANG HAE CHOON ,  SHIN YUN SUK

Inventor： YANG HAE CHOON ,  SHIN YUN SUK

IPC: B28D5/00 ,  H01L21/00 ,  H01L21/677

CPC classification number: B28D5/0082

Abstract: An apparatus (5) for dicing an integrated circuit substrate having a loader (30) for loading the substrate to the apparatus, said substrate loaded in a first direction corresponding to a loading axis, an inlet rail (35) said inlet rail including a first block (75) movable along said inlet rail (35) to which is loaded the substrate from said loader, wherein said inlet rail is arranged to deliver the first block (75) and substrate towards a chuck table (60) in a second direction orthogonal to the loading axis.

Abstract translation: 一种用于对集成电路基板进行切割的设备（5），所述集成电路基板具有用于将所述基板装载到所述装置的装载器（30），所述基板沿对应于加载轴线的第一方向装载，所述入口轨道（35）包括第一 沿着所述入口轨道（35）移动的块（75），从所述入口轨道（35）向所述入口轨道（35）移动，所述入口轨道布置成沿第二方向正交地将第一块（75）和衬底朝着卡盘台 到加载轴。

公开(公告)号：WO2010071609A2

公开(公告)日：2010-06-24

申请号：PCT/SG2009000484

申请日：2009-12-17

Applicant: ROKKO VENTURES PTE LTD ,  YANG HAE CHOON

Inventor： YANG HAE CHOON

IPC: H01L21/66

CPC classification number: H01L21/67271 ,  H01L22/12 ,  H01L22/20

Abstract: A system for processing a substrate comprising a loading station for receiving the substrate; a bottom surface inspection station for inspecting the bottom surface of the substrate; a top surface inspection station for inspecting the top surface of the substrate and; a sorting station for sorting the substrate into a predetermined category based upon the bottom surface inspection and top surface inspection.

Abstract translation: 一种用于处理衬底的系统，包括用于接收衬底的装载站; 用于检查基板的底面的底面检查台; 用于检查衬底的顶表面的顶表面检查站; 分选站，用于基于底面检查和顶面检查将基板分类为预定类别。

公开(公告)号：WO2008063138A3

公开(公告)日：2010-04-15

申请号：PCT/SG2007000402

申请日：2007-11-22

Applicant: ROKKO VENTURES PTE LTD ,  LING NEE SENG ,  ANG SOO LOO ,  PAI TER SIANG

Inventor： LING NEE SENG ,  ANG SOO LOO ,  PAI TER SIANG

IPC: G01R1/04 ,  H01L23/498 ,  H05K3/34

CPC classification number: B23K3/0623 ,  B23K2201/40 ,  H01L21/4853 ,  H01L2924/0002 ,  H05K3/3478 ,  H05K3/3489 ,  H01L2924/00

Abstract: A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.

Abstract translation: 一种用于将焊球阵列安装到集成电路的多个基板的装置，包括：用于在加载位置接收第一基板的第一板; 所述第一板适于从基板装载位置横向平移到通量接收位置; 所述第一板还适于从基板装载位置旋转180°，使得第一板处于焊球接收位置，并且 将焊球安装到第一板上。

公开(公告)号：WO2009134212A1

公开(公告)日：2009-11-05

申请号：PCT/SG2009/000158

申请日：2009-05-04

Applicant: ROKKO VENTURES PTE LTD ,  JUNG, Jong Jae ,  JANG, Deok Chun ,  HA, Chang Hwan ,  LIM, Chong Chen ,  BEAK, Seung Ho

Inventor： JUNG, Jong Jae ,  JANG, Deok Chun ,  HA, Chang Hwan ,  LIM, Chong Chen ,  BEAK, Seung Ho

IPC: B28D5/00 ,  H01L21/304 ,  H01L21/78

CPC classification number: B28D5/0058 ,  H01L21/78

Abstract: A system for cutting a plurality of substrates of integrated circuit units comprising a plurality of tables (40, 55), each table including a plurality of trays (37A, 37B, 57A, 57B), each tray arranged to receive one of said substrates; each of said tables selectively movable between a respective loading station (20) for receiving said substrates and a cutting station for cutting the substrates, and a substrate placement device (35) for placing the substrates on the respective trays of said tables; wherein the substrate placement device is arranged to sequentially place substrates on said tables with said tables arranged to sequentially move to the cutting station after receiving the substrates and then return to their respective loading stations for placement of additional substrates.

Abstract translation: 一种用于切割包括多个台（40,55）的集成电路单元的多个基板的系统，每个台包括多个托盘（37A，37B，57A，57B），每个托盘布置成容纳所述基板之一; 每个所述台可以选择性地在相应的用于接收所述基板的装载站（20）和用于切割基板的切割站之间移动;以及基板放置装置（35），用于将所述基板放置在所述台的各个托盘上; 其中所述基板放置装置被布置成将基板顺序地放置在所述台上，其中所述台布置成在接收到所述基板之后依次移动到所述切割站，然后返回到其各自的装载站以放置附加的基板。

公开(公告)号：WO2010071609A3

公开(公告)日：2010-06-24

申请号：PCT/SG2009/000484

申请日：2009-12-17

Applicant: ROKKO VENTURES PTE LTD ,  YANG, Hae, Choon

Inventor： YANG, Hae, Choon

IPC: H01L21/67

Abstract: A system for processing a substrate (100) comprising a loading station for receiving the substrate; a bottom surface inspection station (30) for inspecting the bottom surface of the substrate; a top surface inspection station (35) for inspecting the top surface of the substrate and; a sorting station for sorting the substrate into a predetermined category based upon the bottom surface inspection and top surface inspection.

公开(公告)号：WO2008063138A2

公开(公告)日：2008-05-29

申请号：PCT/SG2007/000402

申请日：2007-11-22

Applicant: ROKKO VENTURES PTE LTD ,  LING, Nee Seng ,  ANG, Soo Loo ,  PAI, Ter Siang

Inventor： LING, Nee Seng ,  ANG, Soo Loo ,  PAI, Ter Siang

IPC: G01R1/04 ,  H01L23/498 ,  H05K3/34

CPC classification number: B23K3/0623 ,  B23K2201/40 ,  H01L21/4853 ,  H01L2924/0002 ,  H05K3/3478 ,  H05K3/3489 ,  H01L2924/00

Abstract: A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.

Abstract translation: 一种用于将焊球阵列安装到集成电路的多个基板的装置，包括：用于在加载位置接收第一基板的第一板; 所述第一板适于从基板装载位置横向平移到通量接收位置; 所述第一板还适于从基板装载位置旋转180°，使得第一板处于焊球接收位置，并且 将焊球安装到第一板上。

公开(公告)号：WO2012050524A1

公开(公告)日：2012-04-19

申请号：PCT/SG2011/000267

申请日：2011-07-26

Applicant: ROKKO VENTURES PTE LTD ,  YANG, Hae Choon ,  JANG, Deok Chun

Inventor： YANG, Hae Choon ,  JANG, Deok Chun

IPC: H01L21/67

CPC classification number: H01L21/67766 ,  H01L21/67333 ,  H01L21/67721 ,  H01L21/67778

Abstract: A shuttle table assembly comprising a shuttle table for receiving a plurality of IC units at a first position and for offloading said units at a second position, said shuttle table movable from said first to second position; a cover assembly mounted to said shuttle table, the cover assembly having at least one cover movable from an open position to a closed position, said closed position covering said units on the shuttle table; wherein the cover assembly is coupled to a guide for closing the cover as the shuttle table moves from the first to the second position.

Abstract translation: 一种梭床组件，包括用于在第一位置处接纳多个IC单元并在第二位置卸载所述单元的梭床，所述梭台可从所述第一位置移动到第二位置; 安装到所述梭台的盖组件，所述盖组件具有至少一个可从打开位置移动到关闭位置的盖，所述关闭位置覆盖所述穿梭台上的所述单元; 其中当所述梭台从所述第一位置移动到所述第二位置时，所述盖组件联接到导向件以关闭所述盖。