公开(公告)号：WO2022085029A1

公开(公告)日：2022-04-28

申请号：PCT/IN2021/051001

申请日：2021-10-22

Applicant: SAINT-GOBAIN GLASS FRANCE ,  THANGAMANI, Arunvel

Inventor： SRIDHARAN, Keerthivasan ,  JAYARAM, Robin C ,  RICHARDSON D, Samson

IPC: H01Q1/32 ,  B32B17/06 ,  G06V10/40 ,  E06B3/663

Abstract: The present disclosure relates to a system dispenses and pastes the patch electronic s/antennas in an automotive glazing manufacturing line. It includes an imaging unit (101) configured to obtain one or more parameters associated with the glazing, a processing unit (102) configured to obtain data from the imaging unit (101) and process the data from the imaging unit (101) to determine a location for dispensing and affixing the electronic unit on the glazing and an actuating unit (103) configured to obtain the location from the processing unit (102) and to accurately and adjustably affix the electronic unit precisely at the determined location. The disclosed system provides for accurate positioning and pasting of the electronic unit on the glazing and computes the tolerance stacking data for facilitating the same.

公开(公告)号：WO2022064519A1

公开(公告)日：2022-03-31

申请号：PCT/IN2021/050929

申请日：2021-09-22

Applicant: SAINT-GOBAIN GLASS FRANCE ,  THANGAMANI, Arunvel

Inventor： SRIDHARAN, Keerthivasan ,  JAYARAM, Robin C ,  BODA, Abhinav

IPC: G01N25/72 ,  B32B17/06 ,  G06T7/00

Abstract: The present disclosure provides an apparatus and a method for determining defects, and uses multi response imaging and sensor fusion to determine the defects associated with soldering process in an automotive vehicle glazing manufacturing line. The disclosed apparatus (100) for determining defects in a vehicle glazing. Said apparatus comprises plurality of sensors (101) configured to obtain at least temperature, images of one or more connecting regions on the vehicle glazing during a soldering process on the vehicle glazing. The apparatus further includes a data acquisition system (102) operably configured with the plurality of sensors for obtaining data from said sensors and a control unit (103) comprising a processing unit operably configured with the data acquisition system for analyzing the occurrence of a defect during the soldering process based on an analytical module. The apparatus also includes an alert unit (104) for providing alerts on detecting the occurrence of a defect.