Abstract:
A method of manufacturing a photodiode for an image sensor which can drastically improve sensitivity compared to silicon-based devices and is advantageous for miniaturization, and a photodiode manufactured thereby. The method of this invention includes (a) applying a photoresist onto a silicon substrate; (b) forming a recess of a predetermined depth in the silicon substrate through exposure and etching; (c) forming a germanium layer in the recess of the silicon substrate formed in step (b); and (d) subjecting the germanium layer formed in step (c) to crystal growth. According to the method of this invention, even though the germanium layer is formed to be thin on the silicon substrate, since germanium has high light absorption efficiency, superior light intensity properties may be exhibited to those of image sensors based on silicon, resulting in sufficiently absorbed light. Further, small image sensors may be manufactured in this invention.
Abstract:
Disclosed herein is an image sensor having a photodiode based on germanium, which has higher sensitivity than image sensors using photodiodes based on silicon, and is manufactured to be small. The image sensor of this invention includes a first conductive silicon substrate having a recess of a predetermined depth, a second conductive doped germanium layer formed through crystal growth in the recess of the first conductive silicon substrate, a first conductive doped silicon layer formed on the first conductive silicon substrate and the second conductive doped germanium layer, second conductive doped silicon layers formed through a doping process to a predetermined depth of the first conductive silicon substrate via the first conductive doped silicon layer, an insulating film layer formed on the first conductive doped silicon layer and the second conductive doped silicon layers, and gate electrodes formed on the insulating film layer. According to this invention, the photodiode using germanium is applied, and thus sensitivity is improved hundreds of times as great as that of a silicon-based device. As well, a silicon substrate is used, whereby considerable portions of conventional silicon-based manufacturing processes may be applied without change.
Abstract:
Provided is an image sensor and a method of manufacturing the same. The image sensor includes anti-reflection films which are formed between a plurality of metal wire lines of the lowest metal wiring layer and a semiconductor substrate and between one of the metal wiring layers and another metal wiring layer. The image sensor having the anti-reflection films according to the present invention can reduce color crosstalk and noises in comparison with a conventional image sensor by using the anti-reflection films formed above the surroundings of the photodiodes.
Abstract:
Provided is a unit pixel of an image sensor in which photodiodes are arranged in a stacking structure and transfer gates are provided for the respective photodiodes so that signals are sequentially transferred to extract information on a plurality of color components and, by which dark current generated at a substrate surface can be reduced by using a buried-type photodiode. Accordingly, since a buried-type photodiode is used in a unit pixel of an image sensor including a photodiode having a stacking structure, dark current generated by surface detect can be suppressed. In addition, since signals are sequentially transferred through transfer gates for respective photodiodes having a stacking structure, information on a plurality of color components can be extracted without having to use complex peripheral circuits.
Abstract:
Disclosed is a fluorescent biochip diagnosis device including: an image sensor having a plurality of photo-detectors; and a band-pass filter unit having a plurality of band-pass filters formed on a plurality of the photo-detectors, wherein a plurality of the band-pass filters are implemented by forming a nanostructure pattern in a metal layer. Since the fluorescent biochip diagnosis device has little optical loss due to a short interval between the biochip and the photo-detector, excellent sensitivity can be provided. Also, since signals can be simultaneously measured by combining light beams having a short wavelength used as an illumination depending on a type of a fluorescent protein material, cost of the diagnosis device and a diagnosis time can be reduced.
Abstract:
Provided is a stacked image sensor. Particularly, provided are a stacked image sensor including a photosensitive element portion having a photo-conductive thin film on an upper portion of a wafer where a peripheral circuit is formed and a method of manufacturing the stacked image sensor. In the stacked image sensor according to the present invention, since a wafer where a circuit is formed and a photosensitive element portion are formed in a stacked structure, a whole size of the image sensor can be reduced, and there is no optical crosstalk due to absorption of incident light to adjacent pixels. In addition, since a photo-conductive element having a high light absorbance is used, a high photo-electric conversion efficiency can be obtained. In addition, in the method of manufacturing a stacked image sensor according to the present invention, since the upper photosensitive element can be formed by using a simple low-temperature process, a production cost can be reduced.
Abstract:
The present invention relates to a unit pixel of an image sensor having a large area photodiode with high sensitivity, and more particularly, to a unit pixel of an image sensor having a high sensitivity photodiode which includes a plurality of transfer gates on the photodiode having a large area to effectively transfer photocharges generated at the photodiode to a floating diffusion region.
Abstract:
A photodiode for an image sensor having an improved light sensitivity and decrease in size over a silicon-based photodiode and a manufacturing method of the photodiode are provided. The photodiode for the image sensor has a silicon-germanium alloy layer, which contains germanium of 0.1 to 15 wt% with respect to a weight of silicon-germanium alloy, formed on a silicon substrate and a photodioderegion formed on the silicon-germanium alloy layer. Since the light absorbance of germanium is high, the photodiode in which a relatively thin silicon- germanium alloy layer is formed has a superior property of optical sensing to a conventional silicon-based image sensor. Accordingly, the silicon-germanium alloy layer thinner than a silicon layer used in a conventional image sensor can be used for absorbing sufficient light so as to decrease in size of the image sensor using the photodiode. In addition, it is possible to operate the photodiode at a high speed due to rapid transport of charges in the silicon-germanium alloy layer.
Abstract:
The present invention relates to a technology for reducing dark current noise by discharging electrons accumulated on a surface of an image sensor photodiode. In an N-type or P-type photodiode, a channel is formed between the photodiode and a power voltage terminal, so that electrons (or holes) accumulated on a surface of the photodiode are discharged to the power voltage terminal through the channel.
Abstract:
A diagnosis device using an image sensor and a method of manufacturing the same are provided. The diagnosis device using the image sensor includes: a substrate in which an image sensor including a plurality of optical sensors is formed; an insulation layer formed on the substrate; and a plurality of wells formed in the insulation layer in correspondence with the plurality of optical sensors, the plurality of wells into which reference samples for biochemical reactions with a target sample are inserted.