公开(公告)号：WO2005030980A2

公开(公告)日：2005-04-07

申请号：PCT/US2004031179

申请日：2004-09-22

Applicant: SNAKE CREEK LASERS LLC

Inventor： BROWN DAVID C

IPC: C12Q20060101 ,  H01S3/02 ,  H01S3/04 ,  H01S3/042 ,  H01S3/06 ,  H01S3/07 ,  H01S3/091 ,  H01S3/0941 ,  H01S3/108 ,  H01S3/109 ,  H01S3/113 ,  H01S3/131 ,  H01S3/16 ,  H01S5/00 ,  C12Q

CPC classification number: H01S3/0627 ,  H01S3/025 ,  H01S3/0405 ,  H01S3/042 ,  H01S3/0604 ,  H01S3/09415 ,  H01S3/108 ,  H01S3/109 ,  H01S3/113 ,  H01S3/1317 ,  H01S3/1611 ,  H01S3/1673

Abstract: A miniaturized laser package is provided comprising a standard semiconductor laser package modified to accept a solid state microchip assembly pumped by the diode laser. Standard packages described in the invention include TO and HHL packages all of which are characterized by small dimensions, well sealed housing, robust mounting features, known characterized materials and economical production and assembly techniques characteristic of the semiconductor processing industry. In particular, the microchip lasers are produced using high density techniques that lend themselves to mass production, resulting in very low unit costs. At the same time, the compact laser devices provide a solution to the problem of providing laser radiation at high beam quality and good reliability features with a variety of wavelengths and operational characteristics and low noise features not available from diode lasers yet relying primarily on standardized designs, materials and techniques common to diode laser manufacturing. The devices constructed according to methods taught by the invention can therefore be readily integrated into numerous applications where power, reliability and performance are at a premium but low cost is essential, eventually replacing diode lasers in many existing systems but also enabling many new commercial, biomedical, scientific and military systems.

Abstract translation: 提供了一种小型化激光器封装，其包括被修改为接受由二极管激光器泵浦的固态微芯片组件的标准半导体激光器封装。 本发明中描述的标准包装包括TO和HHL包装，其特征在于小尺寸，密封的外壳，坚固的安装特征，已知的特征材料以及半导体加工工业特征的经济生产和组装技术。 特别地，微芯片激光器是使用高密度技术生产的，这些技术适合于批量生产，导致非常低的单位成本。 同时，紧凑型激光器件提供了一种解决方案，可以提供高光束质量的激光辐射和良好的可靠性特征，具有多种波长和操作特性以及二极管激光器不可用的低噪声特性，但主要依靠标准化设计 ，二极管激光器制造的材料和技术。 因此，根据本发明教导的方法构造的器件可以容易地集成到许多应用中，其中功率，可靠性和性能是重要的，但是低成本是至关重要的，最终在许多现有系统中替代二极管激光器，而且还使许多新的商业，生物医学 科学和军事系统。

公开(公告)号：WO2006037076A3

公开(公告)日：2006-10-05

申请号：PCT/US2005034927

申请日：2005-09-28

Applicant: SNAKE CREEK LASERS LLC

Inventor： BROWN DAVID C

IPC: H01S3/04

CPC classification number: H01S3/042 ,  H01S3/025 ,  H01S3/027 ,  H01S3/0405 ,  H01S3/0407 ,  H01S3/0604 ,  H01S3/0606 ,  H01S3/061 ,  H01S3/0612 ,  H01S3/07 ,  H01S3/08072 ,  H01S3/094057 ,  H01S3/0941 ,  H01S3/1618 ,  H01S3/1643

Abstract: Methods and constructions for cryogenically cooled solid state lasers are provided that allow the cooling channels to be embedded within the heat sinks used to conductively cool the laser medium. Several gain medium geometries are disclosed that are compatible with efficient and straight forward cryogenic cooling techniques using practical pump chamber designs while eliminating the need for the pump light to traverse the cryogenic layers and allowing for smooth temperature cycling. A number of active material configurations that can be generally adapted for pumping by high power diodes - including slab, thin disk, active mirror and rod geometries - are shown to be compatible with the cryogenic cooling approaches of the invention. Modeling results based on the preferred cooling configurations indicate substantial improvement in the performance of common solid state lasers, including Nd and Yb-doped lasers.

Abstract translation: 提供用于低温冷却的固态激光器的方法和结构，其允许将冷却通道嵌入用于传导冷却激光介质的散热器内。 公开了几种增益介质几何形状，其与使用实际泵室设计的高效且直接向前的低温冷却技术兼容，同时消除了泵浦光穿过低温层并允许平稳温度循环的需要。 示出了可以通常适用于通过高功率二极管（包括平板，薄盘，有源镜和杆几何形状）进行泵浦的许多活性材料构造与本发明的低温冷却方法兼容。 基于首选冷却配置的建模结果表明，普通固态激光器（包括Nd和Yb掺杂激光器）的性能得到了实质性改善。