公开(公告)号：WO2013008425A1

公开(公告)日：2013-01-17

申请号：PCT/JP2012/004357

申请日：2012-07-05

Applicant: SONY CORPORATION ,  SAKANO, Yorito ,  MABUCHI, Keiji ,  MACHIDA, Takashi

Inventor： SAKANO, Yorito ,  MABUCHI, Keiji ,  MACHIDA, Takashi

IPC: H04N5/355 ,  H01L27/146 ,  H04N5/374 ,  H04N5/3745

CPC classification number: H01L27/14643 ,  H01L27/14609 ,  H01L27/14612 ,  H01L27/14616 ,  H01L27/14625 ,  H01L27/14638 ,  H01L27/14689 ,  H04N5/353 ,  H04N5/3559 ,  H04N5/3591 ,  H04N5/37452

Abstract: A solid-state imaging device includes a photoelectric conversion section configured to generate photocharges and a transfer gate that transfers the photocharges to a semiconductor region. A method for driving a unit pixel includes a step of accumulating photocharges in a photoelectric conversion section and a step of accumulating the photocharges in a semiconductor region. A method of forming a solid-state imaging device includes implanting ions into a well layer through an opening in a mask, implanting additional ions into the well layer through an opening in another mask, and implanting other ions into the well layer through an opening in yet another mask. An electronic device includes the solid-state imaging device.

Abstract translation: 固态成像装置包括被配置为产生光电荷的光电转换部分和将光电荷转移到半导体区域的传输门。 用于驱动单位像素的方法包括在光电转换部分中累积光电荷的步骤和在半导体区域中积累光电荷的步骤。 形成固态成像装置的方法包括通过掩模中的开口将离子注入阱层，通过另一掩模中的开口将额外的离子注入到阱层中，并通过其中的开口将其它离子注入到阱层中 又一个面具。 电子设备包括固态成像装置。

公开(公告)号：WO2014129148A1

公开(公告)日：2014-08-28

申请号：PCT/JP2014/000734

申请日：2014-02-13

Applicant: SONY CORPORATION

Inventor： MABUCHI, Keiji

IPC: H04N5/374 ,  H04N5/3745

CPC classification number: H04N5/37455 ,  H04N5/3742 ,  H04N5/37457 ,  H04N5/3765 ,  H04N5/378 ,  H04N5/63

Abstract: An imaging device includes a pixel region in which light sensing pixels are grouped into pixel-units that each include multiple pixels, each column including pixels from at least two of the pixel-units. Each of the pixel-units is connected, via a corresponding readout line, to a corresponding readout unit configured to perform analog-to-digital conversion on pixel signals output thereto. A scanning unit that extends in a column direction is configured to select pixels for readout by applying row scanning pulses to scan lines connected to rows. A scanning unit that extends in a row direction for applying readout-enabling scan pulses to lines connected to columns is omitted. Those pixels that are selected for readout by one of the row scanning pulses are read out independently of any enabling pulses applied to lines connected to columns.

Abstract translation: 成像装置包括像素区域，其中光感测像素被分组成每个包括多个像素的像素单元，每个列包括来自至少两个像素单元的像素。 每个像素单元经由相应的读出线连接到对应的读出单元，该读出单元被配置为对输出到其上的像素信号执行模数转换。 沿列方向延伸的扫描单元被配置为通过施加行扫描脉冲来扫描连接到行的线来选择用于读出的像素。 省略了扫描单元，其沿行方向延伸以将读出使能扫描脉冲施加到与列连接的线路。 被选择用于读取行扫描脉冲之一的那些像素被独立于施加到连接到列的线的使能脉冲独立地读出。

公开(公告)号：WO2014125785A1

公开(公告)日：2014-08-21

申请号：PCT/JP2014/000555

申请日：2014-02-03

Applicant: SONY CORPORATION

Inventor： MABUCHI, Keiji

IPC: H04N5/341 ,  H04N5/378 ,  H04N5/376

CPC classification number: H04N5/37455 ,  H04N5/341 ,  H04N5/376 ,  H04N5/3765 ,  H04N5/378

Abstract: A solid-state imaging device comprises a plurality of pixel blocks arranged in a matrix, each of the pixel blocks including a plurality of pixels that generate a charge in response to input light; a control unit including a vertical scanning unit and a horizontal scanning unit; and a plurality of analog-to-digital converters, each of the analog-to-digital converters disposed corresponding to pixel blocks. The control unit is configured to sequentially scan the pixels at a timing so that adjacent pixels which are located on a boundary of adjacent pixel blocks are scanned simultaneously.

Abstract translation: 固态成像装置包括以矩阵排列的多个像素块，每个像素块包括响应于输入光产生电荷的多个像素; 包括垂直扫描单元和水平扫描单元的控制单元; 以及多个模拟 - 数字转换器，每个模数转换器对应于像素块设置。 控制单元被配置为在定时顺序地扫描像素，使得位于相邻像素块的边界上的相邻像素被同时扫描。

公开(公告)号：WO2015111389A1

公开(公告)日：2015-07-30

申请号：PCT/JP2015/000129

申请日：2015-01-14

Applicant: SONY CORPORATION

Inventor： IMOTO, Tsutomu ,  MABUCHI, Keiji

IPC: H01L27/146

CPC classification number: H01L27/14887 ,  H01L27/14609 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14654 ,  H01L27/14656 ,  H01L27/14689 ,  H01L27/14812

Abstract: There is provided an imaging device that includes photovoltaic type pixels that have photoelectric conversion regions generating photovoltaic power for each pixel depending on irradiation light; and an element isolation region that is provided between the photoelectric conversion regions of adjacent pixels and in a state of substantially surrounding the photoelectric conversion region.

Abstract translation: 提供了一种成像装置，其包括具有光电转换区域的光电式像素，该光电转换区域根据照射光为每个像素产生光伏电力; 以及设置在相邻像素的光电转换区域之间并且基本上围绕光电转换区域的状态的元件隔离区域。

公开(公告)号：WO2014013696A1

公开(公告)日：2014-01-23

申请号：PCT/JP2013/004216

申请日：2013-07-08

Applicant: SONY CORPORATION

Inventor： YANAGITA, Takeshi ,  MABUCHI, Keiji

IPC: H01L27/146

CPC classification number: H01L27/1469 ,  H01L27/14612 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14689

Abstract: A solid-state imaging device and method of making a solid-state imaging device are described herein. By way of example, the solid-state imaging device includes a first wiring layer formed on a sensor substrate and a second wiring layer formed on a circuit substrate. The sensor substrate is coupled to the circuit substrate, the first wiring layer and the second wiring layer being positioned between the sensor substrate and the circuit substrate. A first electrode is formed on a surface of the first wiring layer, and a second electrode is formed on a surface of the second wiring layer. The first electrode is in electrical contact with the second electrode.

Abstract translation: 本文描述了固态成像装置和制造固态成像装置的方法。 作为示例，固态成像装置包括形成在传感器基板上的第一布线层和形成在电路基板上的第二布线层。 传感器基板耦合到电路基板，第一布线层和第二布线层位于传感器基板和电路基板之间。 第一电极形成在第一布线层的表面上，第二电极形成在第二布线层的表面上。 第一电极与第二电极电接触。

公开(公告)号：WO2013145661A1

公开(公告)日：2013-10-03

申请号：PCT/JP2013/001938

申请日：2013-03-21

Applicant: SONY CORPORATION

Inventor： MABUCHI, Keiji

IPC: H04N5/3745 ,  H04N9/04 ,  H01L27/146 ,  H04N5/347

CPC classification number: H04N5/37213 ,  H01L27/14609 ,  H01L27/14612 ,  H01L27/14654 ,  H01L27/14831 ,  H04N5/347 ,  H04N5/37452 ,  H04N5/37457 ,  H04N5/378 ,  H04N9/045

Abstract: A solid state imaging element including a drive circuit and a pixel unit with pixels arranged in a matrix form. The pixels include a photoelectric conversion element configured to convert light incident thereupon into a charge and to accumulate the charge, a charge holding unit connected to the photoelectric conversion element, and a floating diffusion region. The drive circuit transfers a first portion of the charge accumulated in the photoelectric conversion element to the charge holding unit and concurrently transfers a second portion of the charge accumulated in the photoelectric conversion element to the floating diffusion region. Electronic global shutter is realized by transferring charge from the photoelectric conversion elements of each of the pixels at substantially the same time.

Abstract translation: 一种固态成像元件，包括驱动电路和具有以矩阵形式布置的像素的像素单元。 像素包括光电转换元件，被配置为将入射到其中的光转换为电荷并积累电荷，连接到光电转换元件的电荷保持单元和浮动扩散区。 驱动电路将积蓄在光电转换元件中的电荷的第一部分传送到电荷保持单元，同时将累积在光电转换元件中的电荷的第二部分传送到浮动扩散区。 基本上同时从每个像素的光电转换元件传送电荷来实现电子全局快门。