公开(公告)号：WO1998003305A1

公开(公告)日：1998-01-29

申请号：PCT/US1997012386

申请日：1997-07-16

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  ALLEN, Robert, F. ,  HOLZAPFEL, Paul ,  BARTELS, Anthony, L. ,  LIN, Warren

IPC: B24B37/04

CPC classification number: B24B37/0053 ,  B24B37/04 ,  B24B49/04 ,  B24B49/12 ,  G05B19/401 ,  G05B19/402 ,  G05B2219/23231 ,  G05B2219/36372 ,  G05B2219/37002 ,  G05B2219/37117 ,  G05B2219/37125 ,  G05B2219/37266 ,  G05B2219/37283 ,  G05B2219/37286 ,  G05B2219/37573 ,  G05B2219/45232

Abstract: An apparatus for use with a chemical mechanical planarization (CMP) system includes a light source that generates an interrogation signal and directs the interrogation signal toward a polishing pad configured to process a workpiece during the CMP procedure. A reflected signal produced in response to the interrogation signal is received by a detector, and the optical characteristics of the reflected signal are processed and analyzed to determine whether extraneous material is present within an area of the polishing pad. The apparatus may employ alternative light sources and processing techniques to advantageously operate in conjunction with a variety of polishing pads having different physical characteristics.

Abstract translation: 用于化学机械平面化（CMP）系统的装置包括产生询问信号的光源，并且将询问信号引导到在CMP过程期间被配置为处理工件的抛光垫。 响应于询问信号产生的反射信号由检测器接收，并且对反射信号的光学特性进行处理和分析，以确定外部材料是否存在于抛光垫的区域内。 该装置可以采用替代光源和处理技术来有利地与具有不同物理特性的各种抛光垫一起工作。