公开(公告)号：WO2008121752A1

公开(公告)日：2008-10-09

申请号：PCT/US2008/058553

申请日：2008-03-28

Applicant: SUSS MICROTEC, INC.

Inventor： GORMLEY, Gerard ,  GORUN, Patrick ,  DAVIDSON, Michael

IPC: H01L21/60

CPC classification number: B23K3/0623 ,  B23K2201/40 ,  B23K2201/42 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/131 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2203/0126 ,  H01L2224/0401

Abstract: An improved apparatus for filling patterned mold cavities formed on a surface of a mold structure with solder includes an injector head assembly comprising a solder reservoir having a bottom surface with an elongated slot for injecting solder into the mold cavities and a carriage assembly configured to carry and scan the mold structure under the injector head assembly. The mold structure is brought into contact with the solder reservoir bottom surface and a seal is formed between an area of the solder reservoir bottom surface surrounding the elongated slot and the mold structure surface and then the mold structure is scanned under the injector head assembly in a first direction from a starting position to a finish position for filling the mold cavities and in a second direction opposite to the first direction for returning back from the finish position to the starting position.

Abstract translation: 用于填充在模具结构的表面上形成的图案化模腔的改进装置包括：具有焊料储存器的注射器头组件，所述焊料储存器具有底表面，该底表面具有用于将焊料注入到模腔中的细长槽;以及支架组件， 扫描注射器头部组件下方的模具结构。 模具结构与焊料储存器底表面接触，并且在围绕细长槽的焊料储存器底表面的区域和模具结构表面之间形成密封件，然后在注射器头部组件下方扫描模具结构 从起始位置到完成位置的第一方向，用于填充模具腔，并且在与第一方向相反的第二方向上从终点位置返回到起始位置。