公开(公告)号：WO2023280602A2

公开(公告)日：2023-01-12

申请号：PCT/EP2022/067392

申请日：2022-06-24

Applicant: TDK ELECTRONICS AG

Inventor： HOJAS, Gerhard ,  LAMPL, Siegfried ,  ALFARRO SAMON MASAN, Lamablawa Mario Valentino

IPC: H01C1/014 ,  H01C1/144 ,  H01C17/28 ,  H01G2/06 ,  H01G13/00 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40 ,  H01L23/00 ,  H01G4/232 ,  H01C1/01 ,  H01C17/281 ,  H01C17/283 ,  H01G13/006 ,  H01G2/065 ,  H01L2224/16225 ,  H01L24/80 ,  H01L24/81 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/0367 ,  H05K2201/10636 ,  H05K2201/10916 ,  H05K2203/1115 ,  H05K3/328 ,  H05K3/4007 ,  H05K3/4015

Abstract: The present application addresses a method for establishing an electronic connection to an electronic component (4) and a chip assembly. The method comprises the following steps. First, an electronic component (4) having a first welding part, e.g. region of a terminal electrode (5) is provided. Also a first electrical contact piece, e.g. contact pad (3), is provided. The first welding part and the first electrical contact piece are brought into mechanical contact with each other. Subsequently, while the mechanical contact is maintained, a welding current is applied which is capable of welding the electrical contact piece and the welding part together.