公开(公告)号：WO2022058311A1

公开(公告)日：2022-03-24

申请号：PCT/EP2021/075243

申请日：2021-09-14

Applicant: DANFOSS SILICON POWER GMBH

Inventor： WOEHL, Robert ,  MÖSS, Frederic

IPC: H01L23/498 ,  H05K3/328 ,  H01L21/485

Abstract: A method for connecting two or more conductors with connection pads to a substrate, comprising the steps of: placing a first connection pad of a first conductor and a second connection pad of a second conductor such that the first connection pad is arranged between the second connection pad and the substrate and subsequently carrying out a welding process, in which the second connection pad and the first connection pad are welded to each other and to the substrate.

公开(公告)号：WO2021146270A2

公开(公告)日：2021-07-22

申请号：PCT/US2021/013217

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter, Alexandre ,  BURK, James, A. ,  MILLER, Galen, W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie, G. ,  LAPS, Mark, R.

IPC: H01L23/495 ,  H05K1/11 ,  H05K3/46 ,  H01G4/30 ,  H01G4/224 ,  H01G4/228 ,  H01G4/38 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：WO2023280602A2

公开(公告)日：2023-01-12

申请号：PCT/EP2022/067392

申请日：2022-06-24

Applicant: TDK ELECTRONICS AG

Inventor： HOJAS, Gerhard ,  LAMPL, Siegfried ,  ALFARRO SAMON MASAN, Lamablawa Mario Valentino

IPC: H01C1/014 ,  H01C1/144 ,  H01C17/28 ,  H01G2/06 ,  H01G13/00 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40 ,  H01L23/00 ,  H01G4/232 ,  H01C1/01 ,  H01C17/281 ,  H01C17/283 ,  H01G13/006 ,  H01G2/065 ,  H01L2224/16225 ,  H01L24/80 ,  H01L24/81 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/0367 ,  H05K2201/10636 ,  H05K2201/10916 ,  H05K2203/1115 ,  H05K3/328 ,  H05K3/4007 ,  H05K3/4015

Abstract: The present application addresses a method for establishing an electronic connection to an electronic component (4) and a chip assembly. The method comprises the following steps. First, an electronic component (4) having a first welding part, e.g. region of a terminal electrode (5) is provided. Also a first electrical contact piece, e.g. contact pad (3), is provided. The first welding part and the first electrical contact piece are brought into mechanical contact with each other. Subsequently, while the mechanical contact is maintained, a welding current is applied which is capable of welding the electrical contact piece and the welding part together.

公开(公告)号：WO2021146284A1

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

公开(公告)号：WO2022005764A1

公开(公告)日：2022-01-06

申请号：PCT/US2021/037987

申请日：2021-06-18

Applicant: GENTHERM GMBH

Inventor： CIACCIO, Michael Peter

IPC: H05K1/18 ,  H05K3/04 ,  H05K1/0393 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10272 ,  H05K2203/0228 ,  H05K2203/0285 ,  H05K3/0058 ,  H05K3/043 ,  H05K3/28 ,  H05K3/284 ,  H05K3/328 ,  H05K3/341 ,  H05K3/361

Abstract: A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

公开(公告)号：WO2022002596A1

公开(公告)日：2022-01-06

申请号：PCT/EP2021/066275

申请日：2021-06-16

Applicant: VITESCO TECHNOLOGIES GERMANY GMBH

Inventor： SCHÖPP, Christopher ,  KÜCHLER, Maximilian

IPC: H05K3/32 ,  H01R12/00 ,  H01R12/55 ,  H05K2201/10833 ,  H05K2203/107 ,  H05K3/328

Abstract: Die Erfindung betrifft einen Formdraht (10) zur unmittelbaren und/oder mittelbaren elektrischen Verbindung mit einer Kontaktfläche (12) einer Leiterplatte (14) und/oder einer Kontaktfläche eines elektrischen Bausteins, wobei der Formdraht (10) an einem jeweiligen distalen Ende (16), bezogen auf einen Querschnitt des Formdrahts (10) senkrecht zu dessen Längsrichtung (18), einen Endabschnitt (20) mit einer Aufstandsfläche (22) aufweist, wobei die Endabschnitte (20) über einen Steg (24) miteinander verbunden sind, und der Steg (24) gegenüber den Endabschnitten (20) und/oder den Aufstandsflächen (22) in einer Richtung senkrecht zur Längsrichtung (18) des Formdrahts (10) zumindest abschnittsweise zurückspringend ausgebildet ist.

公开(公告)号：WO2021146284A8

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/224 ,  H01G4/228 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0204 ,  H05K1/0259 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.