MELT-EXTRUDED SUBSTRATE FOR USE IN THERMOFORMED ARTICLES
    2.
    发明申请
    MELT-EXTRUDED SUBSTRATE FOR USE IN THERMOFORMED ARTICLES 审中-公开
    用于热成型制品的熔融挤出基材

    公开(公告)号:WO2013032971A1

    公开(公告)日:2013-03-07

    申请号:PCT/US2012/052434

    申请日:2012-08-27

    摘要: A melt-extruded substrate that can be readily thermorformed into a shaped, three-dimensional article is provided. The substrate is formed from a polymer composition that contains a thermotropic liquid crystalline polymer and a unique aromatic amide oligomer. The present inventors have discovered that the oligomer can help increase the "low shear" complex viscosity of the resulting polymer. The ability to achieve enhanced low shear viscosity values can lead to polymer compositions with an increased melt strength, which allows the resulting substrate to better maintain its shape during thermoforming without exhibiting a substantial amount of sag. Due to its relatively high degree of melt strength, the polymer composition is particularly well suited for forming thin extruded substrates for use in thermoforming processes.

    摘要翻译: 提供了可以容易地热成型为成形的三维制品的熔融挤出的基材。 基材由含有热致液晶聚合物和独特芳族酰胺低聚物的聚合物组合物形成。 本发明人已经发现,低聚物可以帮助提高所得聚合物的“低剪切”复数粘度。 获得增强的低剪切粘度值的能力可以导致具有增加的熔体强度的聚合物组合物,这允许所得到的基材在热成型期间更好地保持其形状而不显示大量的下垂。 由于其熔体强度相对较高,聚合物组合物特别适用于形成用于热成型工艺的薄的挤出基材。