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公开(公告)号:WO2014204570A2
公开(公告)日:2014-12-24
申请号:PCT/US2014/034455
申请日:2014-04-17
Applicant: UNITED TECHNOLOGIES CORPORATION
Inventor: MCBRIEN, John , CASTLE, Lea, Kennard , SPANGLER, Brandon, W. , XU, JinQuan
CPC classification number: F01D5/28 , B22C7/02 , B22C9/02 , B22C9/043 , B22C9/061 , B22C9/10 , B22C9/101 , B22C9/108 , B22C9/22 , B22C9/24 , B22D23/06 , B22D25/02 , B22D27/04 , B22D27/045 , B22F3/1055 , B22F3/11 , B22F3/24 , B22F5/04 , B22F2003/248 , B22F2998/00 , B22F2998/10 , B23K15/0006 , B23K15/0086 , B23K26/342 , B32B1/08 , B32B3/08 , B32B3/26 , B32B5/16 , B32B9/005 , B32B2250/03 , B32B2264/105 , B32B2603/00 , B33Y10/00 , B33Y80/00 , C30B11/00 , C30B29/52 , F01D5/147 , F01D5/18 , F01D5/187 , F01D5/282 , F01D9/02 , F01D9/041 , F01D9/065 , F01D25/12 , F05D2220/32 , F05D2230/31 , F05D2300/175 , F05D2300/211 , F05D2300/607 , F23R3/28 , Y02P10/292 , Y02P10/295 , B22F2003/242 , C30B11/14
Abstract: One embodiment includes a method to regenerate a component (10). The method includes additively manufacturing a component (10) to have voids greater than 0 percent but less than approximately 15 percent in a near finished shape. The component (10) is encased in a shell mold (22). The shell mold (22) is cured. The encased component (10) is placed in a furnace and the component (10) is melted. The component (10) is solidified in the shell mold (22). The shell mold (22) is removed from the solidified component (10).
Abstract translation: 一个实施例包括再生组件(10)的方法。 该方法包括在接近完成的形状中相加地制造具有大于0%但小于约15%的空隙的部件(10)。 组件(10)被封装在壳模(22)中。 壳模(22)固化。 被封装的部件(10)被放置在炉中并且部件(10)熔化。 组分(10)在壳模(22)中固化。 从凝固组分(10)中除去壳模(22)。
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2.
公开(公告)号:WO2014204569A3
公开(公告)日:2014-12-24
申请号:PCT/US2014/034453
申请日:2014-04-17
Applicant: UNITED TECHNOLOGIES CORPORATION
Inventor: MCBRIEN, John , CASTLE, Lea, Kennard , SPANGLER, Brandon, W. , XU, JinQuan
Abstract: One embodiment includes a method to regenerate a component. The method includes additively manufacturing the component with at least a portion of the component in a near finished shape. The component is encased in a shell mold, the shell mold is cured, the encased component is placed in a furnace and the component is melted, the component is solidified in the shell mold, and the shell mold is removed from the solidified component.
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