WIRING INTEGRATION/BACKSHELL INTERFACE CONNECTOR ASSEMBLY
    1.
    发明申请
    WIRING INTEGRATION/BACKSHELL INTERFACE CONNECTOR ASSEMBLY 审中-公开
    接线整合/背板接口连接器总成

    公开(公告)号:WO1996019021A1

    公开(公告)日:1996-06-20

    申请号:PCT/US1995016098

    申请日:1995-12-11

    Abstract: A shielded connector assembly for interconnecting individual conductors in an electrical wire harness is provided with a ground ring which eliminates unshielded conductor wire segments after the individual conductor shielding has been stripped. A filter ring assembly is included in the connector assembly for filtering high frequency signals to eliminate cross talk between high and low frequency signal conductors in the same wire harness. Transmission leakage is also eliminated at the juncture between the individual conductors and a circuit board included in the assembly.

    Abstract translation: 用于互连电线束中的各个导体的屏蔽连接器组件设置有接地环,其在单独的导体屏蔽被剥离之后消除非屏蔽的导体线段。 滤波器环组件包括在连接器组件中,用于过滤高频信号以消除同一线束中的高频和低频信号导体之间的串扰。 在各个导体和组件中包含的电路板之间的接合点也消除了传输泄漏。

    LOW PROFILE BACKSHELL/WIRING INTEGRATION AND INTERFACE SYSTEM
    2.
    发明申请
    LOW PROFILE BACKSHELL/WIRING INTEGRATION AND INTERFACE SYSTEM 审中-公开
    低配置背板/接线整合和接口系统

    公开(公告)号:WO1994028600A1

    公开(公告)日:1994-12-08

    申请号:PCT/US1994004342

    申请日:1994-04-20

    Abstract: Multiple conductor wire harnesses in aircraft or the like are interconnected by a single low profile compact backshell assembly (2). The backshell assembly (2) includes a housing (4) which shields the individual conductors in the housing from ambient EMI noise. The housing (4) has one or more wire harness inlet assemblies (14) and a plurality of outlet sockets (36). One or more semi-flexible circuit boards (20) are disposed in the housing (4) and are operable to interconnect the individual conductor wires (44) in each inlet with pin and socket conductor connections at the respective outlets (36). The circuit board (20) provides interconductor EMI noise shielding inside of the housing (4). Splice connections between conductors can be formed as necessary within the circuit board inside of the housing to allow any degree of inlet to outlet conductor signal paths to be formed inside of the housing as are desired.

    Abstract translation: 飞机等中的多根导线线束通过单个低调紧凑的后壳组件(2)相互连接。 后壳组件(2)包括壳体(4),其将壳体中的各个导体屏蔽环境EMI噪声。 壳体(4)具有一个或多个线束入口组件(14)和多个插座(36)。 一个或多个半柔性电路板(20)设置在壳体(4)中并且可操作以将每个入口中的各个导体线(44)与相应出口(36)处的销和插座导体连接互连。 电路板(20)在壳体(4)的内部提供了隔离EMI噪声屏蔽。 导体之间的接合连接可以根据需要形成在壳体内的电路板内,以允许根据需要在壳体内形成任何程度的入口到出口导体信号路径。

    MODULAR BACKSHELL INTERFACE SYSTEM
    3.
    发明申请
    MODULAR BACKSHELL INTERFACE SYSTEM 审中-公开
    模块式背板接口系统

    公开(公告)号:WO1994024729A1

    公开(公告)日:1994-10-27

    申请号:PCT/US1994003267

    申请日:1994-03-24

    Abstract: Multi-conductor strand wiring harnesses are connected together by a backshell having several internal semi-flexible circuit boards disposed therein. A minimal non-shielded conductor window is provided between the inlet and outlet connections in the backshell. The backshell is composed of interconnected modules, one of which is connected to each wire harness, and the other of which is mounted on a grounded component of the craft. At least one of the modules contains semi-flexible circuit boards which interconnect input and output conductor pin arrays on the module. The modules are interconnected by mating pin and socket assemblies.

    Abstract translation: 多导体线束线束通过其中设置有多个内部半柔性电路板的后壳连接在一起。 在后壳中的入口和出口连接之间提供最小的非屏蔽导体窗口。 后壳由互连的模块组成,其中一个模块连接到每个线束,另一个模块安装在飞机的接地部件上。 至少有一个模块包含半柔性电路板,其将模块上的输入和输出导体引脚阵列互连。 模块通过配合销和插座组件互连。

    BACKSHELL INTERFACE SYSTEM
    4.
    发明申请
    BACKSHELL INTERFACE SYSTEM 审中-公开
    BACKSHELL接口系统

    公开(公告)号:WO1994016478A1

    公开(公告)日:1994-07-21

    申请号:PCT/US1993011561

    申请日:1993-12-01

    CPC classification number: H01R9/032 H01R13/6593 H01R13/6594 H01R13/6658

    Abstract: Multi-conductor strand wiring harnesses are connected together by a backshell having several internal semi-flexible circuit boards disposed therein. A minimal non-shielded conductor window is provided between the inlet and outlet connections in the backshell. The system allows interconnections between round and flat connector pin arrays. The use of multiple circuit boards in the backshell allows a multiplicity of inlet to outlet connections to be made, and also reduces the size and weight of the backshell assembly. Right angle connections are readily made in a minimal spatial envelope.

    Abstract translation: 多导体线束线束通过其中设置有多个内部半柔性电路板的后壳连接在一起。 在后壳中的入口和出口连接之间提供最小的非屏蔽导体窗口。 该系统允许圆形和扁平连接器针阵列之间的互连。 在后壳中使用多个电路板允许制造多个入口到出口连接,并且还减小后壳组件的尺寸和重量。 直角连接容易在最小的空间包络中进行。

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