ULTRASONIC IMAGING DEVICES AND METHODS OF FABRICATION
    1.
    发明申请
    ULTRASONIC IMAGING DEVICES AND METHODS OF FABRICATION 审中-公开
    超声成像装置和制造方法

    公开(公告)号:WO2004021404A8

    公开(公告)日:2005-05-19

    申请号:PCT/US0327006

    申请日:2003-08-27

    Abstract: A sensor (16) for an ultrasound imaging catheter (12) and methods of fabrication are provided. The sensor (16) may be based on a flex circuit (32) on which a block of piezoelectric sensor array transducer material is mounted. The flex circuit may include electrical conductors (34) that are electrically connected to electrodes on the piezoelectric blocks. A matching layer may be formed on the piezoelectric blocks between the blocks and the flex circuit substrate. Individual transducer array elements may be formed by dividing a piezoelectric block into a plurality of individual transducer elements after the matching layer has been formed. Cuts may be formed in the flex circuit substrate between adjacent transducer array elements to acoustically decouple adjacent elements. The flex circuit substrate and matching layers may have relatively high impedance to facilitate acoustic impedance matching between the sensor and the imaging environment.

    Abstract translation: 提供了一种用于超声成像导管(12)的传感器(16)和制造方法。 传感器(16)可以基于安装有压电传感器阵列换能器材料块的柔性电路(32)。 柔性电路可以包括电连接到压电块上的电极的电导体(34)。 可以在块和柔性电路基板之间的压电块上形成匹配层。 各个换能器阵列元件可以通过在形成匹配层之后将压电块划分成多个单独的换能器元件来形成。 可以在相邻换能器阵列元件之间的柔性电路基板中形成切口,以使相邻元件声学解耦。 柔性电路衬底和匹配层可以具有相对高的阻抗,以便于传感器和成像环境之间的声阻抗匹配。

    ULTRASONIC IMAGING DEVICES AND METHODS OF FABRICATION
    2.
    发明申请
    ULTRASONIC IMAGING DEVICES AND METHODS OF FABRICATION 审中-公开
    超声成像装置和制造方法

    公开(公告)号:WO2004021404A3

    公开(公告)日:2004-05-21

    申请号:PCT/US0327006

    申请日:2003-08-27

    Abstract: A sensor (16) for an ultrasound imaging catheter (12) and methods of fabrication are provided. The sensor (16) may be based on a flex circuit (32) on which a block of piezoelectric sensor array transducer material is mounted. The flex circuit may include electrical conductors (34) that are electrically connected to electrodes on the piezoelectric blocks. A matching layer may be formed on the piezoelectric blocks between the blocks and the flex circuit substrate. Individual transducer array elements may be formed by dividing a piezoelectric block into a plurality of individual transducer elements after the matching layer has been formed. Cuts may be formed in the flex circuit substrate between adjacent transducer array elements to acoustically decouple adjacent elements. The flex circuit substrate and matching layers may have relatively high impedance to facilitate acoustic impedance matching between the sensor and the imaging environment.

    Abstract translation: 提供了一种用于超声成像导管(12)的传感器(16)和制造方法。 传感器(16)可以基于安装有压电传感器阵列换能器材料块的柔性电路(32)。 柔性电路可以包括电连接到压电块上的电极的电导体(34)。 可以在块和柔性电路基板之间的压电块上形成匹配层。 各个换能器阵列元件可以通过在形成匹配层之后将压电块划分成多个单独的换能器元件来形成。 可以在相邻换能器阵列元件之间的柔性电路基板中形成切口,以使相邻元件声学解耦。 柔性电路衬底和匹配层可以具有相对高的阻抗,以便于传感器和成像环境之间的声阻抗匹配。

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