公开(公告)号：WO2023287422A8

公开(公告)日：2023-01-19

申请号：PCT/US2021/041892

申请日：2021-07-15

Applicant: ZEKU, INC.

Inventor： LOW, Su-Lin ,  CHEN, Na ,  LI, Yunhong ,  MA, Tianan Tim ,  PAO, Sammy Tzu-Kiang

IPC: H04W36/00 ,  H04L69/32 ,  H04W28/16 ,  H04W72/569 ,  H04W76/27 ,  H04W80/02

Abstract: According to one aspect of the disclosure, a baseband chip is provided. The baseband chip may include a Layer 2 hardware circuit configured to perform Layer 2 packet processing. The baseband chip may also include a resource prediction circuit. The resource prediction circuit may include a resource mapping circuit. The resource mapping circuit may be configured to receive a grant indication associated with one or more grant conditions. The resource mapping circuit may be configured to identify a resource mapping table associated with the one or more grant conditions. In some embodiments, the resource mapping table may indicate a resource level ratio for a set of Layer 2 resources associated with the Layer 2 hardware circuit. The resource mapping circuit may be configured to trigger a first resource level change of the set of Layer 2 resources associated with the Layer 2 hardware circuit.