摘要:
Cinta flexible (1) formada por una tira alargada (1L) de material flexible que presenta un espesor longitudinal (e 1L ) que varía a lo largo de la misma definiendo un perfil longitudinal convexo (P 1CX ) o cóncavo (P 1CV ). Y rodillo para enrollar o desenrollar bobinas de material laminado, formado por un cuerpo longitudinal (3) configurado para recibir una banda (102) de material laminado (101) proveniente de una bobina (100), y que presenta una superficie interior (S 2I ) que se encuentra recubierta por dicha cinta flexible (1), formando una superficie exterior (S 2E ) del rodillo (2), longitudinalmente convexa o cóncava, configurada para recibir la banda (102) de material laminado (101).
摘要:
The present invention relates to a polarizing plate and to a liquid crystal display device. The present invention relates to a polarizing plate which is lightweight and thin and has superior physical properties such as durability, water-resistance, workability, adhesion, light-leakage preventing properties, etc. The present invention also relates to a liquid crystal display device comprising the polarizing plate.
摘要:
The present invention relates to a polarizing plate and to a liquid crystal display device. The present invention relates to a polarizing plate which is more lightweight, thin, and has superior physical properties such as durability, water-resistance, workability, adhesion, light-leakage-preventing properties, etc. The present invention also relates to a liquid crystal display device comprising the polarizing plate.
摘要:
The present invention relates to an epoxy-based composition, an adhesive film, a dicing die-bonding film and a semiconductor device employing the same. More specifically, it relates to an epoxy-based composition having a gel content of from 5% to 20% when measured under specific conditions and to an application therefor. The epoxy-based composition according to the present invention can minimise the incidence of burrs during processing while at the same time exhibiting outstanding high-temperature adhesive properties and displaying superior resilience characteristics even when a low glass-transition temperature is set when it is made into an adhesive. Consequently, when the present invention is employed, it can prevent die-pushing defects during high-temperature wire bonding or moulding processing, and it allows the production of outstandingly reliable semiconductor devices due to the superior adhesiveness and workability of the adhesive.