一种脱脂防腐防锈剂
    2.
    发明申请

    公开(公告)号:WO2017197665A1

    公开(公告)日:2017-11-23

    申请号:PCT/CN2016/084278

    申请日:2016-06-01

    Applicant: 罗俊

    Inventor: 罗俊

    CPC classification number: C23G1/00 C23G1/02 C23G1/08 C23G1/14

    Abstract: 本申请公开了一种脱脂防腐防锈剂,包括氢氧化钠50-70份,氯酸钠40-160份,三亚乙基三胺5-20份,盐酸50-150份,磷酸200-400份,黏土15-60份。由此,能够用于黑色金属表面处理,能够同时完成脱脂、除磷、除锈和防腐,减少了多道工序,降低了成本。

    VERFAHREN ZUR SELEKTIVEN ENTFERNUNG VON ZINK-IONEN AUS ALKALISCHEN BADLÖSUNGEN IN DER OBERFLÄCHENBEHANDLUNG VON METALLISCHEN BAUTEILEN IN SERIE
    4.
    发明申请
    VERFAHREN ZUR SELEKTIVEN ENTFERNUNG VON ZINK-IONEN AUS ALKALISCHEN BADLÖSUNGEN IN DER OBERFLÄCHENBEHANDLUNG VON METALLISCHEN BAUTEILEN IN SERIE 审中-公开
    工艺为锌离子的碱性浴液个,串联的金属部件表面处理的选择性脱除

    公开(公告)号:WO2016075183A1

    公开(公告)日:2016-05-19

    申请号:PCT/EP2015/076282

    申请日:2015-11-11

    Abstract: Die vorliegende Erfindung betrifft ein Verfahren zur seriellen Oberflächenbehandlung von metallischen Bauteilen, die Zinkoberflächen aufweisen, wobei das Verfahren eine alkalische Vorbehandlung umfass sowie ein Verfahren zur selektiven Entfernung von Zink-Ionen aus einer alkalischen Badlösung zur seriellen Oberflächenbehandlung von metallischen Oberflächen, die Zinkoberflächen aufweisen. Erfindungsgemäß wird zur Durchführung der jeweiligen Verfahren ein Teil der jeweiligen alkalischen Badlösung mit einem Ionenaustauscherharz in Kontakt gebracht, das funktionelle Gruppen ausgewählt aus -OPO 3 X 2/n und/oder -PO 3 X 2/n , wobei X entweder ein Wasserstoffatom oder ein auszutauschendes Alkali- und/oder Erdalkalimetall-Atom mit der jeweiligen Wertigkeit n darstellt, trägt.

    Abstract translation: 本发明涉及串联表面处理具有锌表面,该方法的金属部件,并且具有碱性预处理umfass,用于从金属表面,所述锌表面的串行表面处理的碱性浴溶液中选择性地除去锌离子的过程的方法。 根据本发明,相应的碱浴液的一部分与在接触的离子交换树脂接触,从所选择的官能团-OPO3X2 / n和/或-PO3X2 / n,用于执行相应方法,其中X是氢原子或可更换的碱金属和/或 代表具有各承载n价碱土金属原子。

    METHOD FOR EXFOLIATING COATING LAYER OF ELECTRODE FOR ELECTROLYSIS
    5.
    发明申请
    METHOD FOR EXFOLIATING COATING LAYER OF ELECTRODE FOR ELECTROLYSIS 审中-公开
    用于电镀的电极涂层的方法

    公开(公告)号:WO2013077454A2

    公开(公告)日:2013-05-30

    申请号:PCT/JP2012/080526

    申请日:2012-11-20

    CPC classification number: C23G1/14 C23G1/02 C25B11/00 C25B15/00 C25C7/06

    Abstract: The present invention relates to a method to effectively exfoliate a coating layer from the surface of the conductive substrate comprising titanium or titanium alloy substrate material of a used electrode for electrolysis comprising an insoluble metal electrode having the coating layer containing electrode substance comprising noble metals and/or their metal oxides on the surface of the used electrode substrate comprising valve metals, such as titanium and tantalum or valve metal alloys and then to recover the electrode substances and/or electrode substrates for recycling use. A method for exfoliating the coating layer from the surface of the electrode substrate, characterized in that in the exfoliation method for the coating layer from the surface of the electrode substrate, wherein the insoluble metal electrode surface having the coating layer containing electrode substance comprising noble metals and/or metal oxides thereof on the surface of the electrode substrate comprising valve metals including titanium and tantalum or valve metal alloys is treated, in succession, with the alkali treatment process using a caustic alkali aqueous solution, the heating and baking process and the acid treatment process by immersion in hydrochloric acid, sulfuric acid, nitric acid or the mixture thereof, the alkali treatment process is conducted by applying an alkali treatment solution prepared by adding thickener to the caustic alkali aqueous solution.

    Abstract translation: 本发明涉及一种从导电性基材的表面有效地剥离涂层的方法,包括用于电解的用过的电极的钛或钛合金基底材料,其包括不溶性金属电极,其具有包含贵金属和/ 或其金属氧化物在包括钛金属和钽或阀金属合金的阀金属的使用电极基板的表面上,然后回收用于再循环使用的电极物质和/或电极基底。 一种从电极基板的表面剥离涂层的方法,其特征在于,在从电极基板的表面剥离涂布层的方法中,其中具有包含贵金属的电极物质的涂层的不溶性金属电极表面 和/或其金属氧化物在包括钛和钽或阀金属合金的阀金属的电极基材的表面上连续地用碱处理工艺使用苛性碱水溶液,加热和烘烤过程和酸 通过浸渍在盐酸,硫酸,硝酸或其混合物中的处理方法,碱处理过程是通过将苛性碱水溶液中加入增稠剂制备的碱处理溶液进行的。

    METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
    6.
    发明申请
    METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES 审中-公开
    用于处理波浪形文章的方法和装置

    公开(公告)号:WO2013061198A1

    公开(公告)日:2013-05-02

    申请号:PCT/IB2012/055534

    申请日:2012-10-12

    Abstract: In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal-containing surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula I in which R, R2 and R3 are each independently selected from hydrogen and C-4 alkyl. The base has a boiling point less than 100°C, and the rinse liquid has a p H in the range 1 of 8 to 10.

    Abstract translation: 在用于处理制品表面的方法和装置中,改进的冲洗液防止静电荷的积聚,同时避免损坏某些类型的暴露的含金属表面。 在一个实施例中,具有包括钴,镍和铂中的至少一种的结构的半导体晶片在旋转卡盘上旋转,因为冲洗液体被分配到晶片的表面上。 漂洗液是式Ⅰ的碱的稀水溶液,其中R,R 2和R 3各自独立地选自氢和C 1-4烷基。 碱的沸点低于100℃,冲洗液的p H在1〜8〜10的范围内。

    METHOD OF HYDROCARBON IMPURITIES REMOVAL FROM SURFACES
    8.
    发明申请
    METHOD OF HYDROCARBON IMPURITIES REMOVAL FROM SURFACES 审中-公开
    从表面去除烃类污染物的方法

    公开(公告)号:WO2002090482A1

    公开(公告)日:2002-11-14

    申请号:PCT/RU2001/000468

    申请日:2001-11-08

    Abstract: The invention relates to methods of surface cleaning from hydrocarbon impurities such as crude oil, petroleum products, lubricating agents, fats of technical and household grades and oils and can be used in various branches of industry for chemical - and mechanized washing and cleaning of process and transportations means. The technical object of the supposed invention is the simplification of the cleaning process, the increase of hydrocarbon impurities recovery during the regeneration of washing solution and the reduction of power consumption for carrying out the cleaning process. The technical results has been achieved owing to the fact that some changes and modifications have been introduced into the known closed-cycle method of hydrocarbon impurities removal from surfaces which includes the preparation of detergent aqueous solution containing nonionic surfactant and an active component, surface washing-off with detergent aqueous solution, pumping-off of the emulsion obtained, separating of the emulsion into aqueous and organic phases followed by the return of aqueous phase into the cleaning cycle and the periodical discharge of the organic phase to a storage tank.

    Abstract translation: 本发明涉及从烃类杂质如原油,石油产品,润滑剂,技术和家用级油脂等油类杂质的表面清洗方法,可用于各行业的化学和机械洗涤和清洗工艺和 运输手段。 本发明的技术目的在于清洗过程的简化,清洗液再生过程中碳氢化合物杂质回收的增加以及进行清洗过程的功耗的降低。 已经实现了技术结果,这是因为在已知的从表面除去碳氢化合物杂质的闭环方法中引入了一些改变和修改,包括制备含有非离子表面活性剂的洗涤剂水溶液和活性组分,表面洗涤 - 用洗涤剂水溶液除去,抽出所获得的乳液,将乳液分离成水相和有机相,然后将水相返回到清洁循环中,并将有机相周期性排出到储罐中。

    除錆用組成物及びそれを使用する除錆方法
    9.
    发明申请
    除錆用組成物及びそれを使用する除錆方法 审中-公开
    用于除锈的组合物和用其除去RUST的方法

    公开(公告)号:WO2002088427A1

    公开(公告)日:2002-11-07

    申请号:PCT/JP2002/004184

    申请日:2002-04-25

    CPC classification number: C11D3/044 C11D3/33 C11D3/349 C23G1/14

    Abstract: A composition for rust removal which is highly effective in removing rust. The composition is a water-soluble composition which comprises a basic compound, a water-soluble metal-chelating agent, and thiourea dioxide and which, when dissolved in an aqueous medium, gives an alkaline solution.

    Abstract translation: 用于除锈的组合物,其高效除锈。 该组合物是包含碱性化合物,水溶性金属螯合剂和二氧化硫脲的水溶性组合物,当溶于水性介质时,得到碱性溶液。

    PROCESS AND APPARATUS FOR CLEANING SILICON WAFERS
    10.
    发明申请
    PROCESS AND APPARATUS FOR CLEANING SILICON WAFERS 审中-公开
    清洗硅砂的工艺和装置

    公开(公告)号:WO0154181A3

    公开(公告)日:2002-01-03

    申请号:PCT/US0102119

    申请日:2001-01-19

    Abstract: An effective electropurge process and apparatus for wet processing of semiconductor wafers applies electrical charges to the wafer surface with an ample voltage sufficient to provide an effective field intensity which can substantially eliminate intolerable sub-0.05 micron "killer" defects when making highly advanced microchips with a feature size or line width less than 0.15 micron. The process can be used with frequent voltage reversal for automated wet-batch cleaning operations using cassettes that hold 10 to 50 wafers at a time and in various other operations involving megasonic transducers, mechanical brush scrubbers, laser cleaners and CMP equipment. The electropurge process is primarily intended for Fab plants where large wafers with a diameter of 200 to 400 mm require 250 to 350 steps including many dry layering, patterning and doping operations and at least 30 wet processing steps.

    Abstract translation: 用于半导体晶片的湿法处理的有效的电镀工艺和设备以足够的电压向晶片表面施加电荷,该电压足以提供有效的场强,其可以在制造高度先进的微芯片时基本上消除不可耐受的亚0.05微米“杀手”缺陷 特征尺寸或线宽小于0.15微米。 该过程可以使用频繁的电压反转来进行自动化的湿批次清洁操作,使用一次可以容纳10到50个晶片的盒,以及涉及兆声波换能器,机械刷洗涤器,激光清洁器和CMP设备的各种其他操作。 电镀工艺主要用于Fab工厂,其中直径为200至400mm的大晶片需要250至350个步骤,包括许多干层压,图案化和掺杂操作以及至少30个湿加工步骤。

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