Abstract:
Die vorliegende Erfindung betrifft ein Verfahren zur seriellen Oberflächenbehandlung von metallischen Bauteilen, die Zinkoberflächen aufweisen, wobei das Verfahren eine alkalische Vorbehandlung umfass sowie ein Verfahren zur selektiven Entfernung von Zink-Ionen aus einer alkalischen Badlösung zur seriellen Oberflächenbehandlung von metallischen Oberflächen, die Zinkoberflächen aufweisen. Erfindungsgemäß wird zur Durchführung der jeweiligen Verfahren ein Teil der jeweiligen alkalischen Badlösung mit einem Ionenaustauscherharz in Kontakt gebracht, das funktionelle Gruppen ausgewählt aus -OPO 3 X 2/n und/oder -PO 3 X 2/n , wobei X entweder ein Wasserstoffatom oder ein auszutauschendes Alkali- und/oder Erdalkalimetall-Atom mit der jeweiligen Wertigkeit n darstellt, trägt.
Abstract:
The present invention relates to a method to effectively exfoliate a coating layer from the surface of the conductive substrate comprising titanium or titanium alloy substrate material of a used electrode for electrolysis comprising an insoluble metal electrode having the coating layer containing electrode substance comprising noble metals and/or their metal oxides on the surface of the used electrode substrate comprising valve metals, such as titanium and tantalum or valve metal alloys and then to recover the electrode substances and/or electrode substrates for recycling use. A method for exfoliating the coating layer from the surface of the electrode substrate, characterized in that in the exfoliation method for the coating layer from the surface of the electrode substrate, wherein the insoluble metal electrode surface having the coating layer containing electrode substance comprising noble metals and/or metal oxides thereof on the surface of the electrode substrate comprising valve metals including titanium and tantalum or valve metal alloys is treated, in succession, with the alkali treatment process using a caustic alkali aqueous solution, the heating and baking process and the acid treatment process by immersion in hydrochloric acid, sulfuric acid, nitric acid or the mixture thereof, the alkali treatment process is conducted by applying an alkali treatment solution prepared by adding thickener to the caustic alkali aqueous solution.
Abstract:
In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal-containing surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula I in which R, R2 and R3 are each independently selected from hydrogen and C-4 alkyl. The base has a boiling point less than 100°C, and the rinse liquid has a p H in the range 1 of 8 to 10.
Abstract:
Méthode d'évaluation de la capacité d'un bain de nettoyage contenant au moins un tensioactif à assurer une fonction de déshuilage de pièces, dans laquelle : on évalue la taille de micelles contenues dans le bain, ces micelles étant au moins partiellement formées dudit tensioactif; et on évalue la capacité dudit bain à absorber de l'huile en fonction des tailles de micelles évaluées.
Abstract:
The invention relates to methods of surface cleaning from hydrocarbon impurities such as crude oil, petroleum products, lubricating agents, fats of technical and household grades and oils and can be used in various branches of industry for chemical - and mechanized washing and cleaning of process and transportations means. The technical object of the supposed invention is the simplification of the cleaning process, the increase of hydrocarbon impurities recovery during the regeneration of washing solution and the reduction of power consumption for carrying out the cleaning process. The technical results has been achieved owing to the fact that some changes and modifications have been introduced into the known closed-cycle method of hydrocarbon impurities removal from surfaces which includes the preparation of detergent aqueous solution containing nonionic surfactant and an active component, surface washing-off with detergent aqueous solution, pumping-off of the emulsion obtained, separating of the emulsion into aqueous and organic phases followed by the return of aqueous phase into the cleaning cycle and the periodical discharge of the organic phase to a storage tank.
Abstract:
A composition for rust removal which is highly effective in removing rust. The composition is a water-soluble composition which comprises a basic compound, a water-soluble metal-chelating agent, and thiourea dioxide and which, when dissolved in an aqueous medium, gives an alkaline solution.
Abstract:
An effective electropurge process and apparatus for wet processing of semiconductor wafers applies electrical charges to the wafer surface with an ample voltage sufficient to provide an effective field intensity which can substantially eliminate intolerable sub-0.05 micron "killer" defects when making highly advanced microchips with a feature size or line width less than 0.15 micron. The process can be used with frequent voltage reversal for automated wet-batch cleaning operations using cassettes that hold 10 to 50 wafers at a time and in various other operations involving megasonic transducers, mechanical brush scrubbers, laser cleaners and CMP equipment. The electropurge process is primarily intended for Fab plants where large wafers with a diameter of 200 to 400 mm require 250 to 350 steps including many dry layering, patterning and doping operations and at least 30 wet processing steps.