Abstract:
The integrated circuit die incorporates a test circuit portion that includes a first electromagnetic receiver for receiving wireless electromagnetic radiation, and a first electromagnetic transmitting element for transmitting wireless electromagnetic radiation in response to the electromagnetic radiation received by the first electromagnetic receiver. The test apparatus includes a second electromagnetic transmitter for transmitting wireless electromagnetic radiation to the first receiver of the integrated circuit die, and a second electromagnetic receiver for receiving wireless electromagnetic radiation transmitted by the first transmitter of the integrated circuit die. According to the method of testing the semiconductor integrated circuit die, test signals are transmitted wirelessly from the test device to the test circuit portion of the semiconductor integrated circuit die. In response to those transmitted test signals, the test circuit portion of the die performs a test sequence, and transmits wireless response signals.
Abstract:
A manufacturing defect analyzer for printed circuit boards which can detect open circuit faults between leads of components and the printed circuit board. The manufacturing defect analyzer can operate in an inductive coupling mode or a capacitive coupling mode. The same sensors are used in each mode, allowing different leads on the same part to be tested using either technique. A method is also disclosed whereby the device is used to rapidly and accurately detect manufacturing defects.
Abstract:
An apparatus and method are disclosed for testing connections between printed circuit boards and components mounted thereon. A conductive loop is formed by forward biasing a parasitic diode that is inherently present between an integrated circuit (IC) lead and the ground plane of the IC. A magnetic field is created by an antenna mounted above the component to be tested. When the antenna is energized by an RF source, a voltage is induced in the conductive loop if the loop is continuous, i.e., if all of the connections are properly made. The voltage in the loop is measured and compared to a selected threshold to produce a pass/fail indication. This tester may be implemented as an improvement to a standard type of "bed-of-nails" printed circuit board tester. The antenna may be implemented as an array of spiral loop antennas, with adjacent antennas producing magnetic fields that are 90 degrees out of phase with each other.
Abstract:
A Transistor Resonant Characteristic Sensor (TReCS) includes a sensing element positioned along electronic equipment so that the sensing element is electromagnetic ally coupled to the electronic equipment. The sensing element includes a coil. The sensing element is configured to detect magnetic oscillations associated with a characteristic signal generated by the electronic equipment. The TReCS sensor further includes an evaluation circuit connected to the sensing element for monitoring health state of the electronic equipment. The evaluation circuit includes one or more processing elements configured to diagnose health state of the electronic equipment based on extracted baseband information associated with the characteristic signal.
Abstract:
A controller for a test head module (106) of a test cell (100) includes a control signal generator, an electronic memory device, and a signal evaluation module. The control signal generator to provide control signals to a plurality of magnetic stimulator heads, which provide magnetic stimulus signals to singulated devices for testing in response to the control signals. The electronic memory device stores instructions for controlling concurrent activation of at least two of the magnetic stimulator heads for parallel testing of the singulated devices. The signal evaluation module receives electrical signals from the singulated devices. The electrical signals from the singulated devices are dependent on the magnetic stimulus signals applied to the singulated devices.
Abstract:
The inventive method and apparatus allow non-contact testing of electronic modules, in particular electronic circuit boards (10), by performing the steps of disposing at least one electromagnetic emission sensing probe or a probe array (1, 1 1-1, 11 1-2 , ..., l X-Y ) a short distance from an electronic module (10) under test; applying test signals to operate the circuit board while sensing electromagnetic emission from a region of the circuit board near the probe or the probe array (1, l 1-1 , 1 1-2 , ..., 1 x-y ); receiving time domain signals provided by the probe or the probe array (1, 1 1-1 , 1 1-2 , ..., 1 x-y ); simultaneously or sequentially establishing frequency domain information of the sensed electromagnetic emission for n sub-ranges of a second frequency range that is contained in the audible frequency range; and selectively emitting audible signals that correspond to the frequency domain information in the second frequency range. The acoustical signature, resulting from said procedures, can be perceived by the operator of the apparatus and compared to a previously heard acoustical signature of an already proven electronic module in order to detect a malfunction of the electronic circuit board (10) under test.
Abstract:
A manufacturing defect analyzer for printed circuit boards which can detect open circuit faults between leads of components and the printed circuit board. The manufacturing defect analyzer can operate in an inductive coupling mode or a capacitive coupling mode. The same sensors are used in each mode, allowing different leads on the same part to be tested using either technique. A method is also disclosed whereby the device is used to rapidly and accurately detect manufacturing defects.
Abstract:
Ein Verfahren zum Prüfen eines zur kontaktlosen Datenkommunikation eingerichteten Schaltkreises (20), welcher eine Antenne (22) und ein mit der Antenne (22) gekoppeltes elektronisches Bauteil (24) umfasst, umfasst daher die folgenden Schritte: Erzeugen (Sl) eines magnetischen Wechselfeldes einer Feldstärke und Anordnen (S2) des Schaltkreises (20) in dem Wechselfeldbereich. Dann wird der elektronische Schaltkreis (20) mittels eines Energiepulses angeregt (S3). In einem weiteren Schritt wird eine Schwingung des Schaltkreises (20) in Antwort auf die Anregung des Schaltkreises durch den Energiepuls erfasst (S4). Die erfasste Schwingung des Schaltkreises (20) wird schließlich ausgewertet (S5), insbesondere hinsichtlich einer Eigenresonanz frequenz des Schaltkreises (20).
Abstract:
Non-destructive localization of open defects in electronic devices is performed with a DC SQUID based RF magnetometer capable of sensing coherent magnetic fields up to 200 MHz and higher. RF magnetic fields (or RF current) images are correlated to conductive paths layout of the electronic device, and the open defect is pinpointed at a location of RF current disappearance on the current image. The bandwidth limitations associated with transmission line delays between SQUID circuit and readout electronic, as well as with near- field coupling between different parts of the measurement scheme, are overcome by superimposing the RF flux emanating from device under study on the modulation flux to produce at the SQUID output a binary phase modulated RF voltage, which is processed to lock the static flux, and to control modulation regime by producing an AC bias for the RF flux, RF readout electronics is based on a double lock- in through sequential demodulation of the RF component of the output SQUID voltage at the modulation flux frequency mm and the RF flux frequency ϖ RF .