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公开(公告)号：WO02052324A9
公开(公告)日：2003-05-01
申请号：PCT/US0143279
申请日：2001-11-20
Applicant: EMCORE CORP
Inventor： ANDERSON GENE R , ARMENDARIZ MARCELINO G , BRYAN ROBERT P , CARSON RICHARD F , CHU DAHWEY , DUCKETT EDWIN B III , GIUNTA RACHEL KNUDSEN , MITCHELL ROBERT T , MCCORMICK FREDERICK B , PETERSON DAVID W , RISING MERIDETH A , REBER CATHLEEN A , REYSEN BILL H
CPC classification number: G02B6/4277 , G02B6/266 , G02B6/3885 , G02B6/4201 , G02B6/4204 , G02B6/4206 , G02B6/4207 , G02B6/421 , G02B6/4212 , G02B6/4219 , G02B6/4227 , G02B6/4239 , G02B6/4249 , G02B6/426 , G02B6/4281 , G02B6/4283 , G02B6/4286
Abstract: A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber (114), and the optoelectronic device may be a vertical cavity surface emitting laser (116). The first non-opaque material (106) may be a UV optical adhesive that provides an optical path and mechanical stability. In another embodiment of the alignment process, the first end of at least one optical element is brought proximate to the first end of at least one optoelectronic device in such a manner that an interstitial space exists between the first end of at least one optoelectronic device and the first end of at least one optical element. This interstitial space is then filled with a non-opaque material after aligning of the optical element and the optoelectronic device.
Abstract translation: 提供了一种用于将至少一根光纤对准和连接到至少一个光电器件的工艺，以便在至少一个光纤与至少一个光电器件之间耦合光。 该方法的一个实施例包括以下步骤：（1）保持靠近至少一个光电子器件的至少一个光学元件，至少一个具有至少第一端的光学元件; （2）将至少一个光学元件与至少一个光电器件对准; （3）在至少一个光电器件的第一端上沉积第一不透明材料; 和（4）使至少一个光学元件的第一端靠近至少一个光电子器件的第一端，使得第一不透明材料接触至少一个光电器件的第一端，而第一端 的至少一个光学元件。 光学元件可以是光纤（114），并且光电子器件可以是垂直腔表面发射激光器（116）。 第一不透明材料（106）可以是提供光路和机械稳定性的UV光学粘合剂。 在对准过程的另一实施例中，使至少一个光学元件的第一端靠近至少一个光电子器件的第一端，使得在至少一个光电器件的第一端和 至少一个光学元件的第一端。 然后在对准光学元件和光电子器件之后，用非不透明材料填充该间隙空间。
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公开(公告)号：WO02052909A3
公开(公告)日：2003-10-09
申请号：PCT/US0143249
申请日：2001-11-20
Applicant: EMCORE CORP
Inventor： ANDERSON GENE R , ARMENDARIZ MARCELINO G , BRYAN ROBERT P , CARSON RICHARD F , DUCKETT EDWIN B III , MCCORMICK FREDERICK B , PETERSON DAVID W , PETERSON GARY D , REYSEN BILL H
CPC classification number: H05K1/189 , G02B6/266 , G02B6/3885 , G02B6/4204 , G02B6/4206 , G02B6/4207 , G02B6/421 , G02B6/4212 , G02B6/4219 , G02B6/4221 , G02B6/4227 , G02B6/4239 , G02B6/4249 , G02B6/4253 , G02B6/4269 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4286 , H01L2224/48137 , H01L2924/3025 , H01L2924/00
Abstract: This invention relates to a flexible printed circuit board (102) that is used in connection with an optical transmitter, receiver or transceiver module (100). In one embodiment, the flexible printed circuit board (102) has flexible metal layers in between flexible insulating layers, and the circuit board (102) comprises: (1) a main body region (306) orientated in a first direction having at least one electrical or optoelectronic device (308); (2) a plurality of electrical contact pads integrated into the main body region (306), where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region (304) extending from one end of the main body region (306); and (4) a head region (302)extending from one end of the buckle region (304), and where the head region (302) is orientated so that is at an angle relative to the direction of the main body region (306). The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip (108) may be adapted to the head region (302) of the flexible printed circuit board (102). In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board (102), and a window is formed in the head region (302) of the flexible printed circuit board (102). Optoelectronic devices (106) are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board (102).
Abstract translation: 本发明涉及一种与光发射器，接收器或收发器模块（100）结合使用的柔性印刷电路板（102）。 在一个实施例中，柔性印刷电路板（102）在柔性绝缘层之间具有柔性金属层，并且电路板（102）包括：（1）沿第一方向定向的主体区域（306），其具有至少一个 电子或光电子器件（308）; （2）集成到主体区域（306）中的多个电接触焊盘，其中电接触焊盘用于将柔性印刷电路板连接到外部环境; （3）从主体区域（306）的一端延伸的带扣区域（304）; 和（4）从所述带扣区域（304）的一端延伸的头部区域（302），并且所述头部区域（302）被定向成相对于所述主体区域（306）的方向成一角度， 。 电接触焊盘可以是球栅阵列，焊球或焊盘阵列，并且它们用于将电路板连接到外部环境。 驱动器或放大器芯片（108）可适用于柔性印刷电路板（102）的头部区域（302）。 在另一个实施例中，散热器沿着柔性印刷电路板（102）的头部区域的表面通过，窗口形成在柔性印刷电路板（102）的头部区域（302）中。 光电子器件（106）以这样的方式适于头吊具，使得它们可通过柔性印刷电路板（102）中的窗口接近。
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公开(公告)号：WO02099490A3
公开(公告)日：2003-07-31
申请号：PCT/US0143353
申请日：2001-11-20
Applicant: EMCORE CORP
Inventor： ANDERSON GENE R , ARMENDARIZ MARCELINO G , BACA JOHNNY R F , BRYAN ROBERT P , CARSON RICHARD F , DUCKETT EDWIN B III , MCCORMICK FREDERICK B , MILLER GREGORY V , PETERSON DAVID W , SMITH TERRANCE T
CPC classification number: G02B6/4277 , G02B6/421 , G02B6/4249 , G02B6/4269 , G02B6/4281 , G02B6/4283 , G02B6/4286 , G02B6/4292 , H05K1/189
Abstract: This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.
Abstract translation: 本发明涉及一种光发射器，接收器或收发器模块，更具体地，涉及一种用于将第一光学连接器连接到第二光学连接器的装置。 所述装置包括：（1）具有至少第一端和至少第二端的壳体，所述壳体的第一端能够接收第一光学连接器，并且壳体的第二端能够接收第二光学连接器 ; （2）从壳体的第一端延伸到壳体的第二端的纵向腔; 和（3）包括壳体的至少一部分的电磁屏蔽。 本发明还涉及一种用于容纳柔性印刷电路板的装置，该装置包括：（1）至少具有第一表面和第二表面的安装结构; （2）沿着安装结构的第一和第二表面的对准脊，对准脊起到对准和固定柔性印刷电路板的作用，所述柔性印刷电路板缠绕并附接到安装结构的第一和第二表面; 和（3）适于安装结构的一系列散热脊，散热脊用于散发由柔性印刷电路板产生的热量。
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Patent Agency Ranking
公开(公告)号：WO02103426A2
公开(公告)日：2002-12-27
申请号：PCT/US0143264
申请日：2001-11-20
Applicant: EMCORE CORP
Inventor： ANDERSON GENE R , ARMENDARIZ MARCELINO G , BRYAN ROBERT P , CARSON RICHARD F , DUCKETT EDWIN B III , KEMME SHANALYN ADAIR , MCCORMICK FREDERICK B , NEVERS JOHN A , PETERSON DAVID W
CPC classification number: G02B6/4277 , G02B6/4201 , G02B6/421 , G02B6/4221 , G02B6/4239 , G02B6/4249 , G02B6/4292 , H05K1/189
Abstract: An optical power control system is provided that may be used in connection with an optical transmitter, receiver or transceiver module. The optical power control system comprises: (1) an array of optoelectronic devices; (2) an array of optical elements; (3) the array of optical elements optically aligned to the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; (4) a light receiving device; and (5) a reflector proximate to the array of optical elements, the reflector optically orientated with the array of optoelectronic devices and the light-receiving device such that some emission from at least one optoelectronic device is reflected on at least a portion of the light-receiving device. The optical elements may be optical fibers and may be packaged in a ferrule. The light-receiving device may be a photo-detector or a light pipe. A feedback loop connects the light-receiving device to the array of optoelectronic devices so as to adjust the output of the array of optoelectronic devices in response to the emission detected by the light-receiving device. The reflector scatters the emission from the optoelectronic device, and it may be adapted to a bottom surface of a ferrule. In another embodiment, optical resin is dispensed proximate to the array of optoelectronic devices and light-receiving device. Emission from at least one optoelectronic device is reflected onto the light-receiving device by the optical resin.
Abstract translation: 提供了可以与光发射器，接收器或收发器模块结合使用的光功率控制系统。 光功率控制系统包括：（1）一组光电器件; （2）光学元件阵列; （3）以与一个或多个光电子器件光学对准的方式将光学元件的阵列光学对准到光电器件的阵列; （4）光接收装置; 和（5）靠近所述光学元件阵列的反射器，所述反射器利用所述光电子器件阵列和所述光接收装置光学取向，使得来自至少一个光电子器件的某些发射在所述光的至少一部分上被反射 接收装置 光学元件可以是光纤，并且可以封装在套圈中。 光接收装置可以是光检测器或光管。 反馈回路将光接收装置连接到光电子器件阵列，以响应于光接收装置检测到的发射来调节光电子器件阵列的输出。 反射器散射来自光电子器件的发射，并且其可以适应于套圈的底表面。 在另一个实施例中，将光学树脂分配到靠近光电器件和光接收装置的阵列。 来自至少一个光电子器件的发射通过光学树脂反射到光接收装置上。
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公开(公告)号：WO03001246A3
公开(公告)日：2003-07-24
申请号：PCT/US0143281
申请日：2001-11-20
Applicant: EMCORE CORP
Inventor： ANDERSON GENE R , ARMENDARIZ MARCELINO G , BRYAN ROBERT P , CARSON RICHARD F , CHU DAHWEY , DUCKETT EDWIN B III , MCCORMICK FREDERICK B , MITCHELL ROBERT T , PETERSON DAVID W , REYSEN BILL H
CPC classification number: G02B6/4239 , G02B6/266 , G02B6/4201 , G02B6/4204 , G02B6/4206 , G02B6/4207 , G02B6/421 , G02B6/4212 , G02B6/4221 , G02B6/4224 , G02B6/4227 , G02B6/4249 , G02B6/426 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4286 , G02B6/4292
Abstract: This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an optoelectronic connector. The optoelectronic connector comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is positioned relative to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the head spreader. Optoelectronic devices may be adapted to the head spreader in such a manner that the devices are accessible through the window in the mounting structure.
Abstract translation: 本发明涉及一种光发射机，接收机或收发机模块，更具体地说，涉及光电连接器。 光电连接器包括：（1）安装结构; （2）适于安装结构的光电子器件的阵列，所述光电器件具有至少第一端; （3）光学元件阵列，所述光学元件阵列至少具有第一端; （4）靠近光电子器件阵列的第一端的光学元件阵列的第一端，使得一个或多个光学元件相对于一个或多个光电子器件定位; 和（5）沿安装结构的头部区域的表面通过的散热器。 安装结构可以是柔性印刷电路板。 头部区域中的热通孔或热管可以将热量从安装结构传递到散热器。 散热器可以为热区域提供机械刚度或刚度。 在另一个实施例中，电触点和接地平面可以沿着头部区域的表面通过，以便提供到光电子器件的电接触路径并限制电磁干扰。 在另一个实施例中，可以在安装结构的头部区域中形成窗口，以便提供对头部扩张器的接近。 光电子器件可以以这样的方式适用于头吊架，即，可以通过安装结构中的窗口来访问设备。
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公开(公告)号：WO02103427A9
公开(公告)日：2003-04-03
申请号：PCT/US0143265
申请日：2001-11-20
Applicant: EMCORE CORP
Inventor： ANDERSON GENE R , ARMENDARIZ MARCELINO G , BACA JOHNNY R F , BRYAN ROBERT P , CARSON RICHARD F , CHU DAHWEY , DUCKETT EDWIN B III , MCCORMICK FREDERICK B , PETERSON DAVID W , PETERSON GARY D , REBER CATHLEEN A , REYSEN BILL H
CPC classification number: G02B6/4239 , G02B6/266 , G02B6/4204 , G02B6/4206 , G02B6/4207 , G02B6/421 , G02B6/4212 , G02B6/4221 , G02B6/4224 , G02B6/4227 , G02B6/4253 , G02B6/4269 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4286 , G02B6/4292 , H01L2224/48091 , H01L2224/48137 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
Abstract: An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The apparatus comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.
Abstract translation: 提供了可以与光发射器，接收器或收发器模块结合使用的光电子安装结构。 该装置包括：（1）安装结构; （2）适于安装结构的光电子器件阵列，所述光电子器件具有至少第一端; （3）光学元件阵列，所述光学元件阵列具有至少第一端; （4）靠近光电子器件阵列的第一端的光学元件阵列的第一端，使得一个或多个光学元件与一个或多个光电子器件光学对准; 和（5）沿安装结构的头部区域的表面通过的散热器。 安装结构可以是柔性印刷电路板。 头部区域中的热通孔或热管可将热量从安装结构传递到散热器。 散热器可以为加热区域提供机械刚性或刚度。 在另一个实施例中，电接触和接地平面可以沿头部区域的表面通过，以提供到光电子器件的电接触路径并限制电磁干扰。 在又一个实施例中，可以在安装结构的头部区域中形成窗口，以提供到散热器的通路。 光电子器件可适用于散热器，使得器件可通过安装结构中的窗口进入。
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公开(公告)号：WO02103426A9
公开(公告)日：2003-04-03
申请号：PCT/US0143264
申请日：2001-11-20
Applicant: EMCORE CORP
Inventor： ANDERSON GENE R , ARMENDARIZ MARCELINO G , BRYAN ROBERT P , CARSON RICHARD F , DUCKETT EDWIN B III , KEMME SHANALYN ADAIR , MCCORMICK FREDERICK B , NEVERS JOHN A , PETERSON DAVID W
CPC classification number: G02B6/4277 , G02B6/4201 , G02B6/421 , G02B6/4221 , G02B6/4239 , G02B6/4249 , G02B6/4292 , H05K1/189
Abstract: An optical power control system is provided that may be used in connection with an optical transmitter, receiver or transceiver module. The optical power control system comprises: (1) an array of optoelectronic devices; (2) an array of optical elements; (3) the array of optical elements optically aligned to the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; (4) a light receiving device; and (5) a reflector proximate to the array of optical elements, the reflector optically orientated with the array of optoelectronic devices and the light-receiving device such that some emission from at least one optoelectronic device is reflected on at least a portion of the light-receiving device. The optical elements may be optical fibers and may be packaged in a ferrule. The light-receiving device may be a photo-detector or a light pipe. A feedback loop connects the light-receiving device to the array of optoelectronic devices so as to adjust the output of the array of optoelectronic devices in response to the emission detected by the light-receiving device. The reflector scatters the emission from the optoelectronic device, and it may be adapted to a bottom surface of a ferrule. In another embodiment, optical resin is dispensed proximate to the array of optoelectronic devices and light-receiving device. Emission from at least one optoelectronic device is reflected onto the light-receiving device by the optical resin.
Abstract translation: 提供了可以与光发射器，接收器或收发器模块结合使用的光功率控制系统。 光功率控制系统包括：（1）一组光电器件; （2）光学元件阵列; （3）以与一个或多个光电子器件光学对准的方式使光学元件光学对准的光学元件阵列; （4）光接收装置; 和（5）靠近所述光学元件阵列的反射器，所述反射器利用所述光电子器件阵列和所述光接收装置光学取向，使得来自至少一个光电子器件的某些发射在所述光的至少一部分上被反射 接收装置 光学元件可以是光纤，并且可以封装在套圈中。 光接收装置可以是光检测器或光管。 反馈回路将光接收装置连接到光电子器件阵列，以响应于光接收装置检测到的发射来调节光电子器件阵列的输出。 反射器散射来自光电子器件的发射，并且其可以适应于套圈的底表面。 在另一个实施例中，将光学树脂分配到靠近光电子器件阵列和光接收装置的位置。 来自至少一个光电子器件的发射通过光学树脂反射到光接收装置上。
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公开(公告)号：WO02052324A3
公开(公告)日：2003-01-09
申请号：PCT/US0143279
申请日：2001-11-20
Applicant: EMCORE CORP
Inventor： ANDERSON GENE R , ARMENDARIZ MARCELINO G , BRYAN ROBERT P , CARSON RICHARD F , CHU DAHWEY , DUCKETT EDWIN B III , GIUNTA RACHEL KNUDSEN , MITCHELL ROBERT T , MCCORMICK FREDERICK B , PETERSON DAVID W , RISING MERIDETH A , REBER CATHLEEN A , REYSEN BILL H
CPC classification number: G02B6/4277 , G02B6/266 , G02B6/3885 , G02B6/4201 , G02B6/4204 , G02B6/4206 , G02B6/4207 , G02B6/421 , G02B6/4212 , G02B6/4219 , G02B6/4227 , G02B6/4239 , G02B6/4249 , G02B6/426 , G02B6/4281 , G02B6/4283 , G02B6/4286
Abstract: A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber (114), and the optoelectronic device may be a vertical cavity surface emitting laser (116). The first non-opaque material (106) may be a UV optical adhesive that provides an optical path and mechanical stability. In another embodiment of the alignment process, the first end of at least one optical element is brought proximate to the first end of at least one optoelectronic device in such a manner that an interstitial space exists between the first end of at least one optoelectronic device and the first end of at least one optical element. This interstitial space is then filled with a non-opaque material after aligning of the optical element and the optoelectronic device.
Abstract translation: 提供了一种过程，用于将至少一根光纤对准并连接到至少一个光电子器件，以便在至少一根光纤和至少一个光电子器件之间耦合光。 该方法的一个实施例包括以下步骤：（1）将至少一个光学元件保持靠近至少一个光电子器件，至少一个光学元件具有至少第一端; （2）将至少一个光学元件与至少一个光电子器件对准; （3）在至少一个光电子器件的第一端上沉积第一非不透明材料; 和（4）使至少一个光学元件的第一端接近至少一个光电子器件的第一端，使得第一非不透明材料接触至少一个光电子器件的第一端，并且第一端 的至少一个光学元件。 光学元件可以是光纤（114），并且光电子器件可以是垂直腔表面发射激光器（116）。 第一非透明材料（106）可以是提供光路和机械稳定性的UV光学粘合剂。 在对准过程的另一个实施例中，至少一个光学元件的第一端部以至少一个光电子器件的第一端部与至少一个光电子器件的第一端部之间存在间隙空间的方式靠近至少一个光电子器件的第一端部， 至少一个光学元件的第一端。 然后在光学元件和光电子器件对准之后，这种间隙空间被填充非透明材料。
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