摘要:
Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.
摘要:
Methods of fabricating a solar cell, and resulting solar cell are described. In an example, the method for fabricating a solar cell include forming an oxide region over a light receiving region of a silicon substrate. The method can include forming an interfacial region over the light receiving surface of the silicon substrate. The method can also include forming a first surface region comprising aluminum oxide over the interfacial region and forming a second surface region over the first surface region. In some embodiments, the first surface region can have a thickness greater than the second surface region. In one embodiment, the second surface region can have a thickness greater than the thickness of the first surface region.
摘要:
A photovoltaic module comprises a back substrate having a plurality of conductive interconnects on top thereof. A conductive interconnect includes a first contact region and a second contact region. The photovoltaic module further comprises a plurality of photovoltaic cells comprising front electrodes disposed on a front surface of a photovoltaic layer on top of back electrodes on top of a support substrate. A plurality of back vias extending through the support substrate of a first cell form an electrical contact between the back electrodes and the second contact region, and a plurality of front vias extending through the support substrate, the back electrodes and the photovoltaic layer of a second cell form an electrical contact between the front electrodes and the first contact region, and is insulated from an electrical contact with the back electrodes and a P side of the photovoltaic layer.
摘要:
The invention relates to a method for producing a solar cell (1), comprising the steps of: (a) providing a silicon substrate (3); (b) producing a boundary surface dielectric layer (5) on a surface of the silicon substrate (3); (c) depositing a silicon layer (7) consisting of amorphous or polycrystalline silicon onto said boundary surface dielectric layer (5), wherein the silicon layer (7) comprises laterally adjoining p-type doped regions (9) and n-type doped regions (11); (d) oxidising the silicon layer (7) in a locally delimited manner in intermediate regions (19) between adjoining p-type doped regions (9) and n-type doped regions (11); and (e) producing p-contacts (31) in contact with the p-type doped regions (9) of the silicon layer (7), and n-contacts (33) in contact with the n-type doped regions (11) of the silicon layer (7). Said locally-delimited oxidation allows the adjoining p-type doped regions (9) and n-type doped regions (11) to be electrically separated from one another, while simultaneously obtaining a good degree of passivation.