Abstract:
An encapsulating method that may include forming an inorganic film layer (031) covering a structure (04) to be encapsulated is provided. The inorganic film layer (031) may include at least two sub-film layers (0311, 0312). Among the at least two sub-film layers (0311, 0312), densification of a sub-film layer (0312) farther away from the structure (04) to be encapsulated may be greater than densification of a sub-film layer (0311) closer to the structure (04) to be encapsulated.
Abstract:
The following relates to barrier coating for organic optoelectronic devices. In particular, the following relates a barrier coating comprising and methods and processes for depositing a barrier coating on a surface.
Abstract:
The present teachings relate to various embodiments of an ink composition, which once printed and cured forms an organic thin film on a substrate such as, but not limited by, an OLED device substrate. Various embodiments of the ink compositions comprise polyethylene glycol di(meth)acrylate monomers, mono(meth)acrylate monomers and multifunctional crosslinking agents.
Abstract:
A display may have thin-film transistor (TFT) circuitry on a substrate. An array of organic light-emitting diodes may be formed on the thin-film transistor circuitry. The display may include inorganic brittle layers and organic and metal layers that are ductile and mechanically robust. To help prevent propagation of cracks and other defects along the edge of the display, the display may be provided with crack stop structures and crack detection circuitry. The crack detection circuitry may include one or more loops that are formed along the periphery of the display. The crack stop structures may include TFT/OLED structures formed in a staggered configuration. At least some of the brittle layers can be removed from the panel edge. An additional adhesion layer may also be formed directly on the substrate to help prevent inorganic layers from debonding from the surface of the substrate.
Abstract:
The present invention is in the field of processes for producing flexible organic-inorganic laminates as well as barrier films comprising flexible organic-inorganic laminates by atomic layer deposition. In particular, the present invention relates to a process for producing a laminate comprising (a) depositing an inorganic layer by an atomic layer deposition process, and (b) depositing an organic layer comprising selenium by a molecular layer deposition process.