WINDOW CAVITY WAFERS
    1.
    发明申请

    公开(公告)号:WO2023059634A1

    公开(公告)日:2023-04-13

    申请号:PCT/US2022/045669

    申请日:2022-10-04

    摘要: Techniques and/or systems are disclosed herein for forming a window cavity wafer that includes fabricating a window wafer by: providing a window wafer substrate having two faces; etching fiducials onto one or more faces of the window wafer substrate; and applying one or more optical coatings to on one or more faces of the window wafer substrate. Next, fabricating a spacer wafer separate from the window wafer by: providing a spacer wafer substrate having two faces; and forming an array of through-holes in the spacer wafer substrate. Then, bonding the spacer wafer to the window wafer to form the window cavity wafer; and forming discrete metal frames on a face of the window cavity wafer.