公开(公告)号：WO2022005764A1

公开(公告)日：2022-01-06

申请号：PCT/US2021/037987

申请日：2021-06-18

Applicant: GENTHERM GMBH

Inventor： CIACCIO, Michael Peter

IPC: H05K1/18 ,  H05K3/04 ,  H05K1/0393 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10272 ,  H05K2203/0228 ,  H05K2203/0285 ,  H05K3/0058 ,  H05K3/043 ,  H05K3/28 ,  H05K3/284 ,  H05K3/328 ,  H05K3/341 ,  H05K3/361

Abstract: A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.