The present invention provides a method for manufacturing the printed substrate which can shorten the manufacturing time and reduce the manufacturing cost. On a position (the first position) which is on a printed substrate (1) with an insulating layer (2) at the surface and is provided with a welding area (3a), CO2 laser (the first laser) is irradiated and a hole (5a) spacing the surface for a depth h has formed, an excimer laser (the second laser) with rectangular scanning beam shape is scanned separated by a mask (1), and the position which is arranged with a welding area (3a) is formed with a hole (5) with depth to the welding area (3a) and a groove (6) (the second position) that is used for forming the electric wiring. At this condition, the CO2 laser can be used for forming a hole (5) from the surface to the welding area (3a).