利索-全球专利检索

  1. 登录
  2. 注册
发明授权
CN101356297B 溅镀装置及成膜方法 失效 - 权利终止

溅镀装置及成膜方法
摘要：
本发明的溅镀装置(1)设有第一～第四靶材(21a～21d)。第一、第二靶材(21a～21b)的表面相互对置，第三、第四靶材(21c～21d)的表面也相互对置。形成介质膜时，交替地溅射第一、第二靶材(21a～21b)和第三、第四靶材(21c～21d)。其表面相互对置的2个靶材(21a～21d)被溅射时，另2个靶材(21a～21d)用作接地的功能。其结果，使异常放电得到了抑制。
摘要（英）：

A spattering device (1) has first to fourth targets (21a) to (21d). The first and second targets (21a, 21b) are disposed so that their surfaces face each other. The third and fourth targets (21c, 21d) are also disposed so that their surfaces face each other. When a dielectric film is formed, the first and second targets (21a, 21b) and the third and fourth targets (21c, 21d) are alternately spattered. When two of the targets (21a to 21d) with their surfaces facing each other are spattered, the other two of the targets (21a to 21d) function as the earth. As the result, abnormal electric discharge can be suppressed.

公开/授权文献
0/0