Disclosed is a method for producing a semiconductor chip. In this method, two or more semiconductor layers (12) are first formed on a substrate (10) by repeatedly forming a sacrifice layer (11) and a semiconductor layer (12) in this order on the substrate (10). Then, the semiconductor layers (12) are divided into a plurality of chips by partially etching the sacrifice layers (11) and the semiconductor layers (12). After that, the chips are separated from the substrate by removing the sacrifice layers (11).