The invention discloses an automatic slicing separating machine, which comprises a cabinet body, a table top and a pair of guide rails, wherein the guide rails are used for guiding semiconductor encapsulation product strips, the shape of the guide rails is matched with the shape of the semiconductor encapsulation product strips to be sliced and separated, the semiconductor encapsulation product strips to be separated are placed along the rails of the guide rails to be sent to positions to be sliced and separated, the guide rails are connected with a second motor through a second gear transmission device, the second motor drives the semiconductor encapsulation product strips to move, the semiconductor encapsulation product strips are sent into a separation cutter to be sliced and separated, the separation cutter is connected with a first motor through a first gear transmission device, the first motor indirectly drives the separation cutter to rotate, a material collection box and a waste material collection box are arranged under the separation cutter, products are separated from the material collection box, and waste materials are separated from the waste material box. The separation machine of the invention completes the material feeding, the edge cutting, the waste material separation and the product counting in one step, the design is reasonable, and the moving is convenient. The production efficiency is improved by more than ten times, in addition, the price of the equipment is low, and the production cost is greatly reduced.