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发明授权
CN102005297B 陶瓷电子部件以及陶瓷电子部件的制造方法 有权

陶瓷电子部件以及陶瓷电子部件的制造方法
摘要：
本发明提供不降低可靠性并能够用无铅焊料直接覆盖基底电极层的陶瓷电子部件以及陶瓷电子部件的制造方法。端子电极(3)具备由烧结而形成的Cu的基底电极层(21)、由Sn-Ag-Cu-Ni-Ge的五元系无铅焊料而形成的焊料层(22)、在基底电极层(21)与焊料层(22)之间通过Ni扩散而形成的扩散层(23)。这样，因为将Ni的扩散层(23)形成于基底电极层(21)与焊料层(22)之间，所以起到作为屏障层的作用的该扩散层(23)能够抑制基底电极层(21)的Cu的焊料侵蚀。另外，Ni的扩散层(23)能够抑制脆的Sn-Cu金属互化物生长。因此，抑制了基底电极层(21)与焊料层(22)之间的接合强度的降低。
摘要（英）：

There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn-Ag-Cu-Ni-Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn-Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.

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