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发明公开
CN102054811A 集成电路结构 有权

集成电路结构
摘要：
本发明揭示一种集成电路结构，包括：一第一工作部件及一第二工作部件。第一工作部件包括一半导体基底以及位于半导体基底上方的一铜凸块。第二工作部件包括一接合垫。一焊料邻接于第一工作部件与第二工作部件之间，其中焊料将铜凸块电性连接至接合垫。焊料包括钯。本发明使焊料的可靠度有明显的改善。
摘要（英）：

An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a semiconductor substrate, and a copper bump over the semiconductor substrate. The second work piece includes a bond pad. A solder is between and adjoining the first work piece and the second work piece, wherein the solder electrically connects the copper bump to the bond pad. The solder includes palladium. The invention improves the reliability of solder obviously.

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