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CN102256452A 具有内置半导体芯片的电路板以及制造该电路板的方法 有权 转让

具有内置半导体芯片的电路板以及制造该电路板的方法
摘要：
本发明涉及具有内置半导体芯片的电路板以及制造该电路板的方法。具体地，本发明提出一种电路板(10)，其包括绝缘构件(20)以及由绝缘构件的热塑性树脂部封装的半导体芯片(50)。布线构件位于绝缘构件中并且电连接半导体芯片的相应侧面上的第一和第二电极(51a-51c)。布线构件包括焊盘(31)、层间连接构件(40)、以及连接部(52)。在第一电极与连接部之间、焊盘与连接部之间、以及第二电极与层间连接构件之间具有扩散层。层间连接构件的至少一种元素具有低于热塑性树脂部的玻璃转化点的熔点。连接部由熔点高于热塑性树脂部的熔点的材料制成。本发明还提出一种制造电路板(10)的方法。
摘要（英）：

The invention refers to a circuit board with a built-in semiconductor chip and a method of manufacturing the same. A circuit board (10) includes an insulating member (20) and a semiconductor chip (50) encapsulated with the thermoplastic resin portion of the insulating member. A wiring member is located in the insulating member and electrically connected to first and second electrodes (51a-51c) on respective sides of the semiconductor chip. The wiring member includes a pad (31), an interlayer connection member (40), and a connection portion (50). A diffusion layer is located between the first electrode and the connection portion between the pad and the connection portion, and between the second electrode and the interlayer connection member. At least one element of the interlayer connection member has a melting point lower than a glass-transition point of the thermoplastic resin portion. The connection portion is made of material having a melting point higher than a melting point of the thermoplastic resin portion. The invention also provides a method of manufacturing the circuit board (10).

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