The invention relates to the field of manufacturing and processing technologies for printed circuit boards, and provides a quick press molding process for multilayer flexible plates. The quick press molding process includes steps of cutting processing, drilling machining, film adhering pre-processing, single-layer flexible plate quick press molding, multilayer flexible plate quick press molding and the like. Exhaust holes are formed in non-molded regions of flexible plates to form bubble passing discharging channels, so that bubbles among layers of the multilayer flexible plates can be effectively removed by means of step-by-step exhaust pre-press molding and quick press molding. The quick press molding process for the multilayer flexible plates has the advantages of good bubble removing effects, convenience and speediness in operation, low cost and wide universality.