Provided is a wiring board having excellent reliability in connection with a semiconductor chip. On the board main surface (11) side of an organic wiring board (10), a first build-up layer (31) is formed, said build-up layer having laminated therein resin insulating layers (21, 22) and conductor layers (24). A conductor layer (24), i.e., the topmost layer of the first build-up layer (31), includes a plurality of connecting terminal sections (41) for flip-chip mounting a semiconductor chip. Each of the connecting terminal sections (41) is exposed through an opening (43) in a solder resist layer (25). Each of the connecting terminal sections (41) has a semiconductor chip connecting region (51), and a wiring region (52) that extends in the planar direction from the connecting region (51). The solder resist layer (25) has, in the opening (43), a side-surface covering section (55) that covers the side surface of each of the connecting terminal sections (41), and a protruding wall section (56), which is integrally formed with the side-surface covering section (55), and which protrudes to intersect the connecting region (51).