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发明公开
CN104851850A 集成电路的背面金属化图形 无效 - 撤回

集成电路的背面金属化图形
摘要：
具有多个管芯的半导体晶圆具有一部分金属化背面。在晶圆切割之后，多个管芯的每个，在其背面，具有由外围无金属化环围绕的金属化区域。该无金属化环允许更容易地对管芯光学检测，以测定任意由晶圆切割造成的背面破损的程度。该外围无金属化环通过不对邻接晶圆的锯通道的区域金属化而生成。
摘要（英）：

A semiconductor wafer with a plurality of tube cores has a part of metalized back side. After the wafer is cut, each of the plurality of tube cores is provided with a metalized area arranged on the back side and surrounded by a peripheral non-metalized ring. The non-metalized ring allows easier tube core optical detection so as to determine any damage degree of the back side caused by wafer cutting. The peripheral non-metalized ring is formed in such a manner that areas of saw channels of adjacent wafers are not subjected to metallization processing.

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