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发明公开
CN109309077A 具有改进的布局的集成电路器件 有权

具有改进的布局的集成电路器件
摘要：
一种集成电路器件包括：器件层，具有根据预定的器件节距间隔开的器件；第一金属互连层，设置在器件层之上并且耦合到器件层；以及第二金属互连层，设置在第一金属互连层之上并且通过第一通孔层耦合到第一金属互连层。第二金属互连层具有根据预定的金属线节距间隔开的金属线，并且预定的金属线节距与预定的器件节距的比率小于1。本发明的实施例还涉及具有改进的布局的集成电路器件。
摘要（英）：

An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1. The invention also relates to an integrated circuit device with an improved layout.

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