The invention relates to a semiconductor device including integrated resin cooler and semiconductor module in which a semiconductor element is sealed in a resin package and provides a technique that suppresses chronological deterioration of cooling performance. The semiconductor device (2) include: a semiconductor module (10), an insulating sheet (16), a cooling plate (20), and a cooler (3). A heat sink is located on at least one surface of the semiconductor module (10). The insulating sheet (16) covers the heat sink. The cooling plate (20) has one surface and another surface, in which the onesurface covers the insulating sheet (16) and is bonded to the surface of the resin package (12), and the other surface is provided with fins (21). The cooling plate (20) is constituted of resin containing heat transfer material. The cooler (3) is configured to flow coolant along the fins (21), in which the cooler surround the cooling plate in a view along a normal direction of the cooling plate (20), and is bonded to both ends of the resin package (12) in the view along the normal direction.