利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN110099518A 树脂基材的制法、印刷配线板的制法、印刷电路板的制法及电子机器的制法 无效 - 撤回

树脂基材的制法、印刷配线板的制法、印刷电路板的制法及电子机器的制法
摘要：
一种树脂基材的制法、印刷配线板的制法、印刷电路板的制法及电子机器的制法，本发明提供一种用于印刷配线板的树脂基材的制造方法，其包括如下步骤：从脱模层侧将树脂基材贴合在表面处理铜箔的步骤；通过将所述表面处理铜箔在不进行蚀刻的情况下从所述树脂基材剥离，而获得在剥离面转印有所述铜箔的表面轮廓的树脂基材的步骤；且所述表面处理铜箔具备：脱模层，其是设置在所述铜箔的具有表面凹凸的面的脱模层，且使从所述脱模层侧向所述铜箔贴合树脂基材时的所述树脂基材可剥离。
摘要（英）：

The invention discloses a manufacturing method of a resin substrate, a manufacturing method of a printed distributing board, a manufacturing method of a printed circuit board, and a manufacturing method of an electronic machine. The manufacturing method of a resin substrate of a printed distributing board comprises following steps: from the demoulding layer side, adhering a resin substrate onto acopper foil with a processed surface; and peeling off the copper foil from the resin substrate without etching to obtain a resin substrate with a shape of the surface of the copper foil. The copper foil comprises a demoulding layer, which has a convex-concave surface, and in the demoulding layer side, the resin substrate can be peeled off from the copper foil.

0/0