A method for manufacturing a flexible printed circuit board and the flexible printed circuit board manufactured by same are disclosed. In the method, base sheets composed of Teflon film having heat resistance and a low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal. The proposed method for manufacturing aflexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.