发明公开
- 专利标题： Electroplating process
- 专利标题（中）： 电镀工艺
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申请号： EP98109457.6申请日： 1998-05-25
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公开(公告)号： EP0883331A3公开(公告)日： 2001-08-16
- 发明人: Couble, Edward C. , Kapeckas, Mark J. , Florio. Steven M. , Jacques, David L.
- 申请人： Shipley Company LLC
- 申请人地址： 455 Forest Street Marlborough, MA 01752 US
- 专利权人： Shipley Company LLC
- 当前专利权人： Shipley Company LLC
- 当前专利权人地址： 455 Forest Street Marlborough, MA 01752 US
- 代理机构： Bunke, Holger, Dr.rer.nat. Dipl.-Chem.
- 优先权： US868092 19970603
- 主分类号： H05K3/42
- IPC分类号： H05K3/42 ; C25D5/54
摘要：
A process for electroplating a substrate by coating the substrate with a coating of carbonaceous particles. The process is characterized by a pretreatment sequence that includes contact of the substrate with a single aqueous solution containing a reducing agent and a polyelectrolyte. The use of the single solution decreases the incidence of interconnect defects in printed circuit manufacture.
公开/授权文献
- EP0883331B1 Electroplating process 公开/授权日：2005-12-21
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