发明公开
- 专利标题: CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
- 专利标题(中): 导电连接片,端子间的连接方法,用于生产连接端子和电子设备
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申请号: EP11736877申请日: 2011-01-18
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公开(公告)号: EP2530786A4公开(公告)日: 2013-07-10
- 发明人: KAGIMOTO TOMOHIRO , CHUMA TOSHIAKI
- 申请人: SUMITOMO BAKELITE CO
- 专利权人: SUMITOMO BAKELITE CO
- 当前专利权人: SUMITOMO BAKELITE CO
- 优先权: JP2010019737 2010-01-29
- 主分类号: H01R11/01
- IPC分类号: H01R11/01 ; B32B15/08 ; C09D7/12 ; C09D201/00 ; H01B1/22 ; H01B5/16 ; H01L21/60 ; H01R4/02 ; H01R43/02 ; H05K3/32
摘要:
A conductive connecting sheet (1) of the present invention is composed of a layered body including resin composition layers (11, 13) and a metal layer (12), and each resin composition layer (11, 13) satisfies the following requirement A: in the case where at least a part of metal ball(s) made of the metal material having low melting point is provided within each resin composition layer (11, 13), the metal ball(s) is heated at a temperature which is a melting temperature thereof or higher according to "test methods for soldering resin type fluxes" defined in JIS Z 3197, and then a wet extension of the metal ball (s) is measured, the wet extension is 37% or more. If the conductive connecting sheet is used for forming connection portions electrically connecting terminals to each other, the connection portions can be formed by selectively aggregating a heated and melted metal material between the terminals and a sealing layer constituted from a resin component can be formed so as to surround the connection portions. As a result, since peripheries of the connection portions can be covered by the resin component, the connection portions are fixed. Further, since an insulating property between the adjacent terminals can be secured by the sealing layer, generation of a leak current between the adjacent terminals can be reliably prevented.
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