The present invention relates to a component carrier (100) comprising a stack (101) comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component (102) embedded in the stack (101); a first thermally conductive block (103) above and thermally connected with the component (102), and a second thermally conductive block (104) below and thermally coupled with the component (102). The heat generated by the component (102) during operation is removed via at least one of the first thermally conductive block (103) and the second thermally conductive block (104).