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公开(公告)号：EP3584813A1
公开(公告)日：2019-12-25
申请号：EP18178702.9
申请日：2018-06-20
摘要： Provided is a method of manufacturing a component carrier (100, 200, 300, 400, 500), wherein the method comprises: forming a magnetic core (101) on a base structure (103); forming a through hole (125) in at least one dielectric layer (127); forming a plurality of electrically conductive windings (129, 131) on the at least one dielectric layer (127) around the through hole (125); forming a stack (141) comprising the base structure (103) having the magnetic core (101), the at least one dielectric layer (127) and another base structure (117) such that the magnetic core (101) is inserted into the through hole (125) and the conductive windings (129, 131) are arranged around the magnetic core (101) and such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure (103) and the other base structure (117).
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公开(公告)号：EP4287785A1
公开(公告)日：2023-12-06
申请号：EP22177225.4
申请日：2022-06-03
发明人： Weis, Gerald , Frauwallner, Rainer
摘要： It is described a component carrier (100), wherein the component carrier (100) comprises:
i) a stack (101) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (102);
ii) a first electronic switch component (110) and a second electronic switch component (120) embedded side-by-side in the stack (101); and
iii) a capacitor device (130), electrically connected in parallel to the first electronic switch component (110) and the second electronic switch component (120);
wherein the capacitor device (130) is assembled, in particular surface-mounted, to the stack (101), so that
the first electronic switch component (110) and the second electronic switch component (120) are at least partially arranged below the capacitor device (130) in a direction (z) perpendicular to the directions of main extension (x, y) of the component carrier (100).-
3.发明公开
公开(公告)号：EP3468317A1
公开(公告)日：2019-04-10
申请号：EP18198723.1
申请日：2018-10-04
发明人： Gavagnin, Marco , Silvano De Sousa, Jonathan , Leitgeb, Markus , Moitzi, Heinz , Krivec, Thomas , Grober, Gernot , Schlaffer, Erich , Morianz, Mike , Frauwallner, Rainer , Haidinger, Hubert , Schulz, Gernot , Gmundner, Gernot , Lutschounig, Ferdinand
摘要： Es wird ein Komponententräger (100, 300) und Verfahren zum Herstellen eines Komponententrägers (100, 300) beschrieben, wobei der Komponententräger einen Trägerkörper (101, 301) aufweist. Der Trägerkörper (101, 301) weist eine Mehrzahl von elektrisch leitenden Schichtstrukturen (104) und/oder elektrisch isolierenden Schichtstrukturen (103) auf, wobei zumindest ein Teil des Komponententrägers (100, 300) als dreidimensional gedruckte Struktur (1831, 1832, 1833) ausgebildet ist.
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公开(公告)号：EP3869923A1
公开(公告)日：2021-08-25
申请号：EP20158509.8
申请日：2020-02-20
摘要： The present invention relates to a component carrier (100) comprising a stack (101) comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component (102) embedded in the stack (101); a first thermally conductive block (103) above and thermally connected with the component (102), and a second thermally conductive block (104) below and thermally coupled with the component (102). The heat generated by the component (102) during operation is removed via at least one of the first thermally conductive block (103) and the second thermally conductive block (104).
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公开(公告)号：EP3709777A1
公开(公告)日：2020-09-16
申请号：EP19161858.6
申请日：2019-03-11
摘要： A component carrier (110) is described, wherein the component carrier (110) comprises: i) a stack (112) comprising at least one electrically conductive layer structure (114) and/or at least one electrically insulating layer structure (116), and ii) at least one elastic element (130) attached to the stack (112) and configured to reversibly connect the component carrier (110) with a further component carrier (120) by elastically deforming the at least one elastic element (130) and essentially not deforming the stack (112) and the further component carrier (120).
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