Invention Patent
- Patent Title: Conductive sheet, product using it and manufacturing method for product
- Patent Title (中): 导电片，产品使用及其制造方法
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Application No.: JP2003346921Application Date: 2003-10-06
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Publication No.: JP2005116674APublication Date: 2005-04-28
- Inventor: MIURA SHIGENORI
- Applicant: Fcm Kk , Fcm株式会社
- Assignee: Fcm Kk,Fcm株式会社
- Current Assignee: Fcm Kk,Ｆｃｍ株式会社
- Priority: JP2003346921 2003-10-06
- Main IPC: B32B15/08
- IPC: B32B15/08 ; C23C4/02 ; C23C14/02 ; C23C14/14 ; C23C14/20 ; C23C14/34 ; C23C14/56 ; C23C18/16 ; C23C18/22 ; C23C28/00 ; C23C28/02 ; C25D5/02 ; C25D5/10 ; H05K1/00 ; H05K1/02 ; H05K1/03 ; H05K3/00 ; H05K3/14 ; H05K3/38
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive sheet in which an insulating substrate and a metallic layer have high adhesive properties while a fine circuit can be formed.
SOLUTION: Regarding the conductive sheet in which the metallic layer is formed to at least a part of the surface of the insulating substrate, the insulating substrate is formed in a long shape, and the surface roughness of an Ra value of the irradiating section of cations reaches 0.2 to 200 nm by irradiating at least the part of the surface of the substrate with cations. Regarding the conductive sheet, the metallic layer is formed to the section irradiated with cations by a sputtering method or an evaporation method.
COPYRIGHT: (C)2005,JPO&NCIPI
SOLUTION: Regarding the conductive sheet in which the metallic layer is formed to at least a part of the surface of the insulating substrate, the insulating substrate is formed in a long shape, and the surface roughness of an Ra value of the irradiating section of cations reaches 0.2 to 200 nm by irradiating at least the part of the surface of the substrate with cations. Regarding the conductive sheet, the metallic layer is formed to the section irradiated with cations by a sputtering method or an evaporation method.
COPYRIGHT: (C)2005,JPO&NCIPI
Public/Granted literature
- JP3641632B1 Conductive sheet, product and a method of manufacturing the same using the same Public/Granted day:2005-04-27
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