一种半导体封装件之制法，其系包括：提供一承载件，其上设置有至少一具有相对之第一表面与第二表面的半导体芯片，且该半导体芯片系以其第一表面接置于该承载件上，且该第二表面上接置有复数第一导电组件；将一具有相对之第三表面与第四表面的中介板以其第三表面接置于该等第一导电组件上，该中介板具有复数嵌埋其中且电性连接该第三表面的导电柱；于该承载件上形成包覆该半导体芯片与中介板的封装层，令该封装层具有面向该承载件之底面与其相对之顶面；从该中介板的第四表面移除部分厚度的该中介板与封装层，以外露该导电柱之一端于该第四表面；以及移除该承载件。本发明能增进接合品质。

This invention provides a manufacturing method of semiconductor package, which includes: providing a carrier on which is provided with at least one semiconductor wafer having opposite a first surface and a second surface, the semiconductor wafer is connectively disposed on the carrier by the first surface, and a plurality of first conductive elements are connectively disposed on the second surface; providing an intermediate plate having opposite a third surface and a forth surface connectively disposed on the first conductive elements by the third surface, the intermediate plate has a plurality of conductive columns embedded therein and electrically connected the third surface; forming a package layer coating the semiconductor wafer and the intermediate plate on the carrier, to cause the package layer to have a bottom surface facing the carrier and have an opposite top surface; removing the intermediate plate and package layer of part thickness from the fourth surface of the intermediate plate, to enable one end of the conductive columns to expose on the fourth surface; and removing the carrier. This invention can enhance the joining quality.