一种封装基板及封装结构，该封装基板系包括复数介电层及复数与各该介电层交互堆栈之线路层，其中，至少二该线路层具有厚度差。本发明能有效避免基板的翘曲现象。

This invention provides a package substrate and a package structure, the package substrate comprises a plurality of dielectric layers and a plurality of wiring layers interactively stacking with each of the dielectric layers, wherein at least two wiring layers have the thickness difference. This invention can effectively avoid the substrate warpage.