一种半导体封装件及其制法，该半导体封装件包括：第一半导体设备，系具有相对之第一顶面与第一底面；复数导通球，系形成于该第一顶面；第二半导体设备，系具有相对之第二顶面与第二底面，且该第二底面系面向该第一顶面；以及复数导电柱，系形成于该第二底面，并分别接合该些导通球以电性连接该第一及第二半导体设备，且该导电柱之高度系小于300微米。借此，本发明可易于控制该半导体封装件之高度，并用于具有更精细间距之导通球之半导体封装件上。

A semiconductor package and manufacturing method thereof are provided. The semiconductor package comprises: a first semiconductor apparatus having opposite a first top surface and a second bottom surface; a plurality of conductive balls formed on the first top surface; a second semiconductor apparatus having opposite a second top surface and a second bottom surface, and the second bottom faces to the first top surface; and a plurality conductive columns formed on the second bottom surface and bonded separately to the conductive balls to connect electrically with the first and second semiconductor apparatuses, and height of the conductive column is small than 300[mu]m. Thereby, the invention can control easily the height of the semiconductor package, and be used for the semiconductor package with finer pitches of the conductive balls.